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MASW-000825-12770T

更新时间： 2024-11-06 14:55:47
品牌 Logo 应用领域
MACOM /
页数 文件大小 规格书
9页 596K
描述
HMIC PIN Diode 20W

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中文翻译

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MASW-000825-12770T 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：ActiveReach Compliance Code：compliant
风险等级：5.17其他特性：HIGH ISOLATION
特性阻抗：50 Ω构造：COMPONENT
最大输入功率 (CW)：43.01 dBm最大插入损耗：1.1 dB
最大工作频率：6000 MHz最小工作频率：50 MHz
最高工作温度：85 °C最低工作温度：-40 °C
射频/微波设备类型：SPDT最大电压驻波比：3
Base Number Matches：1

MASW-000825-12770T 数据手册

 浏览型号MASW-000825-12770T的Datasheet PDF文件第2页浏览型号MASW-000825-12770T的Datasheet PDF文件第3页浏览型号MASW-000825-12770T的Datasheet PDF文件第4页浏览型号MASW-000825-12770T的Datasheet PDF文件第5页浏览型号MASW-000825-12770T的Datasheet PDF文件第6页浏览型号MASW-000825-12770T的Datasheet PDF文件第7页 
HMICTM PIN Diode SP2T 20 W Switch for  
0.05 - 6.0 GHz High Power Applications  
MASW-000825  
Rev. V6  
Features  
Functional Schematic  
•
•
Exceptional Broadband Performance  
Low Loss:  
TX = 0.24 dB @ 2.025 GHz, 35 mA  
TX = 0.38 dB @ 3.500 GHz, 35 mA  
High Isolation:  
RX = 31 dB @ 2.025 GHz, 35 mA  
RX = 27 dB @ 3.500 GHz, 35 mA  
High RF CW Input Power:  
20 W CW (TX Ant Port)  
GND  
N/C GND ANT  
14  
•
N/C  
GND  
Rx  
N/C  
1
GND  
•
•
Tx  
Higher IP3:  
3
10  
>34 dBm (TX Ant Port)  
•
•
Surface Mount 3 mm 12 Lead PQFN Package  
RoHS* Compliant  
GND  
GND  
Applications  
N/C  
N/C N/C N/C  
•
Suitable for High Power TD-SCDMA & WiMax  
Pin Configuration1  
Description  
The MASW-000825 is a 0.05 - 6.0 GHz SP2T PIN  
diode switch assembled is a lead-free compact  
3 mm PQFN plastic package. This high peak and  
Pin #  
Function  
N/C  
1, 5 - 8, 12, 16  
average power switch  
offers  
extraordinary  
2, 4, 9, 11, 13, 15  
GND  
TX  
performance with excellent isolation to loss ratio for  
both the TX and RX States. This SP2T also provides  
outstanding 20 W CW power handling coupled with  
64 dBm IIP3 for maximum switch performance.  
3
10  
14  
Rx  
Ant  
This PIN diode switch is ideally suited for T/R or LNA  
Protect Switch applications such as WiMax and TD-  
SCDMA.  
1. The exposed pad centered on the package bottom must be  
connected to RF, DC and thermal ground.  
This device incorporates a PIN diode die fabricated  
with MACOMs patented Silicon-Glass HMICTM  
process. This chip features two silicon pedestals  
embedded in a low loss, low dispersion glass. The  
diodes are formed on the top of each pedestal. The  
topside is fully encapsulated with silicon nitride and  
has an additional polymer passivation layer. These  
polymer protective coatings prevent damage and  
contamination during handling and assembly.  
Ordering Information2  
Part Number  
Package  
MASW-000825-12770T  
MASW-000825-001SMB  
1000 piece reel, 7 inch  
Sample Board  
2. Reference Application Note M513 for reel size information.  
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
DC-0008119  
1234567...9

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