-10 V to -25 V Driver for PIN Diode Switches
Ceramic Hermetic Package
MADR-011034
Rev. V1
Functional Schematic
Features
•
•
•
•
-10 V to -25 V Back Bias
25 mA Sinking Current
20 mA Sourcing Current
Propagation Delay <130 ns Driving 100 pF
Capacitive Load
Quiescent Currents <1 mA
TTL Logic Control
Internal Active Pull Down for All Logic Controls
Internal Power Sequencer Eliminates External
Power Sequencing
5 mm 32-Lead Ceramic QFN Package
Hermetically Sealed
Upon Request Available as a Fully Screened
Device (Class K & Class H)
RoHS* Compliant
A
B
N/C N/C N/C
N/C
N/C N/C
32
28
25
30 29
31
26
27
N/C
23 DS
1
2
3
4
5
6
7
8
24
EN
C2
•
•
•
•
Level
Shifter
Logic
22
21
VCC
C1
VEEA
N/C
GND
N/C
N/C
N/C
20 N/C
VSEQ
Level
Shifter
•
•
•
19
18 N/C
17 N/C
Power Sequencer
13
•
9
11 12
16
10
15
14
Applications
VEEB
N/C N/C N/C
N/C N/C N/C N/C
•
•
Aerospace & Defense
ISM
Pin Configuration
Description
Pin
Name
Pin #
Description of Function
Enable
The MADR-011034 switch driver is designed to work
with MACOM’s HMIC 20 W CW SPDT PIN diode
switches. This driver has complementary outputs
which can provide up to 25 mA sinking and 20 mA
sourcing bias current to a SPDT PIN diode switch.
An all-off RF state can be achieved with the EN pin
of this driver. An extra control C2 with driver select
DS are provided to allow two drivers working
together to drive a SP3T or SP4T switch.
1
EN
C2
2
Logic Control Input
Logic Control Input
Ground
3
C1
5
GND
12
19
21
22
23
27
29
VEEB Negative Bias for Sequencer Die
VSEQ
VEEA
VCC
DS
B
Power Sequencer Die Output
Negative Bias for Driver Die
Positive Bias
The back bias voltage can be selected to be any
voltage between -10 V and -25 V. This switch driver
can be easily controlled by standard TTL logic. With
low quiescent current, this driver has a typical delay
of <130 ns when driving a 100 pF capacitive load.
Driver Select
Inverted Driver Output
Non-inverted Driver Output
This driver is packaged in a lead-free 5 mm 32-lead
CQFN package and is available in tape and reel
packaging for high volume applications.
A
4, 6, 7, 8, 9,
10, 11, 13, 14,
15, 16, 17, 18, N/C2
20, 24, 25, 26,
No Connection
Ground
Ordering Information
Part Number
MADR-011034
Package
28, 30, 31, 32
33
Paddle3
49 pc. waffle pack
Sample Board
2. N/C pins should be left open.
3. MACOM recommends connecting the exposed pad centered
on the package bottom to RF, DC and thermal ground.
MADR-011034-SMB
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0028436