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MAAP-118260-001SMB PDF预览

MAAP-118260-001SMB

更新时间： 2024-11-10 01:14:55
品牌 Logo 应用领域
泰科 - TE /
页数 文件大小 规格书
13页 1171K
描述
Fully Integrated Power Amplifier

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MAAP-118260-001SMB 数据手册

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MAAP-118260  
Power Amplifier  
18 - 26 GHz  
Rev. V1  
Features  
Functional Schematic  
Fully Integrated Power Amplifier  
Wide Bandwidth 17.7 - 26.5 GHz  
28.5 dB Small Signal Gain  
37.0 dBm Third Order Intercept Point (OIP3)  
28.5 dBm Output P1dB  
Integrated Power Detector  
Typical Bias 5 V, 650 mA  
Lead-Free 5 mm 24-lead QFN Package  
24  
23  
22  
21  
20  
19  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
N/C  
N/C  
Pdet_env  
GND  
GND  
RFIN  
GND  
N/C  
RFOUT  
GND  
Description  
The MAAP-118260 is a packaged linear power  
amplifier that operates over the frequency range  
17.7 - 26.5 GHz. The device provides 28.5 dB of  
gain and 37.0 dBm Output Third Order Intercept  
Point (OIP3) with more than 28.5 dBm of Output  
P1dB.  
N/C  
Pdet_env  
7
8
9
10  
11  
12  
This power amplifier is assembled in a lead free,  
fully molded 5 mm, 24 lead, QFN package and  
consists of a four stage power amplifier with  
integrated, on-chip power and envelope detectors.  
The device includes on-chip ESD protection  
structures to ease the implementation and volume  
assembly.  
Pin Configuration3,4  
Pin No.  
Function  
No Connection  
No Connection  
GND  
Pin No.  
13  
Function  
Pdet_env  
No Connection  
GND  
1
2
14  
The device is well suited for use in the 18 GHz,  
23 GHz, 26 GHz cellular backhaul applications.  
3
15  
4
RFIN  
16  
RFOUT  
5
GND  
17  
GND  
6
No Connection  
VG1,2  
18  
Pdet_env  
Pdet_peak  
VD4  
7
19  
Ordering Information1,2  
8
VG3,4  
20  
Part Number  
MAAP-118260  
Package  
Bulk  
9
No Connection  
No Connection  
VD4  
21  
VD3  
10  
11  
12  
22  
No Connection  
VD1,2  
MAAP-118260-TR0500  
MAAP-118260-001SMB  
Tape and Reel  
Sample Board  
23  
Pdet_peak  
24  
No Connection  
1. Reference Application Note M513 for reel size information.  
2. All sample boards include 5 loose parts.  
3. MACOM recommends connecting unused package pins to  
ground.  
4. The exposed pad centered on the package bottom must be  
connected to RF, DC and thermal ground.  
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
DC-0009796  
1234567...13

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