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MAAP-011139 PDF预览

MAAP-011139

更新时间: 2024-11-21 14:54:15
品牌 Logo 应用领域
MACOM /
页数 文件大小 规格书
12页 1512K
描述
Power Amplifier, 4 W

MAAP-011139 数据手册

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MAAP-011139  
Power Amplifier, 4 W  
28.5 - 31 GHz  
Rev. V1  
Features  
Functional Schematic  
High Gain: 22 dB @ 30 GHz  
P1dB: 34.5 dBm  
PSAT: 36 dBm  
IM3 Level: -27 dBc @ POUT 29 dBm/tone  
Power Added Efficiency: 23% @ PSAT  
Lead-Free 5 mm 32-lead AQFN Plastic Package  
RoHS* Compliant  
32 31 30  
28  
26 25  
29  
27  
GND  
N/C  
1
2
3
4
5
6
7
8
GND  
N/C  
24  
23  
22  
21  
GND  
RFIN  
GND  
N/C  
GND  
RFOUT  
GND  
N/C  
Description  
20  
19  
18  
The MAAP-011139 is a 4-stage, 4 W power amplifier  
assembled in a lead-free 5 mm 32-lead AQFN  
plastic package. This power amplifier operates from  
28.5 to 31 GHz and provides 22 dB of linear gain,  
4 W saturated output power, and 23% efficiency  
while biased at 6 V.  
N/C  
N/C  
GND  
17 GND  
11  
13 14 15  
9
10  
12  
16  
The MAAP-011139 is a power amplifier ideally  
suited for VSAT communications.  
Pin Configuration3  
This product is fabricated using a GaAs pHEMT  
process which features full passivation for enhanced  
reliability.  
Pin No.  
Function  
Ground  
Pin No.  
18, 19  
20  
Function  
1
2
No Connection  
Ground  
No Connection  
Ground  
3
21  
RF Output  
4
RF Input  
22  
Ground  
Ordering Information1,2  
5
Ground  
23  
No Connection  
Ground  
6, 7  
8, 9  
10  
No Connection  
Ground  
24, 25  
26  
Part Number  
Package  
Drain Voltage 4  
Drain Voltage 3  
Drain Voltage 3  
Drain Voltage 2  
No Connection  
Drain Voltage 1  
Ground  
MAAP-011139-TR0500  
MAAP-011139-SMB  
500 piece reel  
Sample Board  
Gate Voltage  
Gate Voltage  
No Connection  
Drain Voltage 3  
Drain Voltage 4  
Ground  
27  
11  
28  
1. Reference Application Note M513 for reel size information.  
2. All sample boards include 3 loose parts.  
12, 13  
14  
29  
30  
15  
31  
16, 17  
32  
Paddle4  
Ground  
*Restrictions on Hazardous Substances,  
European Union Directive 2011/65/EU.  
3. MACOM recommends connecting unused package pins to  
ground.  
4. The exposed pad centered on the package bottom must be  
connected to RF, DC and thermal ground.  
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  

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