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MA4PH235-1072T PDF预览

MA4PH235-1072T

更新时间: 2024-11-24 05:48:07
品牌 Logo 应用领域
泰科 - TE 二极管
页数 文件大小 规格书
7页 370K
描述
Packaged PIN Diodes RoHS Compliant

MA4PH235-1072T 技术参数

生命周期:Transferred包装说明:ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, CASE 1072, 2 PIN
针数:2Reach Compliance Code:unknown
风险等级:5.24最小击穿电压:35 V
标称二极管电容:1.2 pF最大二极管正向电阻:0.5 Ω
二极管电阻测试电流:10 mA二极管电阻测试频率:100 MHz
二极管类型:PIN DIODE少数载流子标称寿命:0.3 µs
最高工作温度:175 °C子类别:PIN Diodes
表面贴装:YESBase Number Matches:1

MA4PH235-1072T 数据手册

 浏览型号MA4PH235-1072T的Datasheet PDF文件第2页浏览型号MA4PH235-1072T的Datasheet PDF文件第3页浏览型号MA4PH235-1072T的Datasheet PDF文件第4页浏览型号MA4PH235-1072T的Datasheet PDF文件第5页浏览型号MA4PH235-1072T的Datasheet PDF文件第6页浏览型号MA4PH235-1072T的Datasheet PDF文件第7页 
Packaged PIN Diodes  
RoHS Compliant  
Rev V.9  
Maximum Power Dissipation  
Features  
High Power  
Fast Speed  
Cathode Heatsink Packages  
P
=
diss  
Voltage Ratings to 1500 Volts  
Wide Selection of Carrier Lifetimes  
Wide Selection of Capacitances  
Assortment of Packages Styles  
Available Screened for Military Applications  
T (max Operating)-25°C  
Thermal Resistance  
30,31,32,36,43,94,111,120,  
150,255 258,296,1072,1079  
Leaded Packages @+25°C  
P
P
= 250mW  
= 300mW  
diss  
diss  
144, 186, 276,1088  
Surface Mount Package +25°C  
Description and Applications  
1056  
M/A-COM's broad line of packaged PIN diodes  
encompasses a comprehensive range of electrical  
characteristics and package outlines. This diverse union  
of semiconductor technology and chip packaging gives  
considerable flexibility to the circuit designer. The fast  
switching series of packaged PIN diodes utilize a thin  
I-region and silicon oxide or glass passivated chips  
which provide for low leakage currents and low insertion  
loss. Using in process control monitors to regulate wafer  
fabrication parameters these devices achieve consistent  
performance in control circuit applications. The high  
voltage product line of packaged PIN diodes employs  
M/A-COM's unique CERMACHIP® passivation process  
which provides for a hard glass encapsulation that  
hermetically seals the active area of the chip. These  
packaged CERMACHIP® PIN diodes are ideally suited  
for use in high power applications where high RF  
voltages are present. The diode chips are bonded into  
sealed ceramic packages that are designed for the most  
stringent electrical and environmental conditions. A wide  
choice of packages are available which can be mounted  
into a variety of microwave and RF circuit media. The  
Packaged PIN Diodes series are designed to have a  
high inherent reliability and may be ordered screened to  
meet many MIL-STD reliability levels.  
Co-Axial Packages  
31,32,94  
36  
30, 296  
120,255  
Leaded/Surface Mount Packages  
Thru Hole  
1088  
276  
1072,1079  
186  
1056  
144  
Threaded Packages  
Absolute Maximum Ratings1  
Parameter  
Absolution Max.  
Voltage  
As Specified in Table  
- 65°C to +175°C  
- 65°C to +200°C  
Operating Temperature  
Storage Temperature  
150  
111  
43  
258  
Unpackaged Die  
Operating and Storage  
(Case Style 1088)  
- 65°C to +125°C  
1. Operation beyond any one of the above conditions may  
cause permanent damage to the device.  
Specifications subject to change without prior notification.  
131,132.134 , 212  
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for  
development. Performance is based on target specifications, simulated results, and/or prototype  
measurements. Commitment to develop is not guaranteed.  
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-  
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has  
been fixed. Engineering samples and/or test data may be available. Commitment to produce in  
volume is not guaranteed.  
North America Tel: 800.366.2266 / Fax: 978.366.2266  
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300  
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298  
Visit www.macomtech.com for additional data sheets and product information.  
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make  
changes to the product(s) or information contained herein without notice.  

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