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MA4P7452F-1072T PDF预览

MA4P7452F-1072T

更新时间： 2024-11-25 14:51:15
品牌 Logo 应用领域
MACOM /
页数 文件大小 规格书
6页 391K
描述
PIN Diode

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中文翻译

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MA4P7452F-1072T 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：R-CELF-N2针数：2
Reach Compliance Code：compliantHTS代码：8541.10.00.80
风险等级：1Is Samacsys：N
其他特性：LOW DISTORTION应用：SWITCHING
最小击穿电压：150 V外壳连接：ISOLATED
配置：SINGLE最大二极管电容：0.7 pF
标称二极管电容：700000 pF二极管元件材料：SILICON
最大二极管正向电阻：0.9 Ω二极管电阻测试电流：100 mA
二极管电阻测试频率：100 MHz二极管类型：PIN DIODE
频带：HIGH FREQUENCY TO ULTRA HIGH FREQUENCYJESD-30 代码：R-CELF-N2
JESD-609代码：e3少数载流子标称寿命：9 µs
元件数量：1端子数量：2
最高工作温度：175 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装形状：RECTANGULAR封装形式：LONG FORM
峰值回流温度（摄氏度）：NOT SPECIFIED最大功率耗散：4 W
认证状态：Not Qualified反向测试电压：100 V
子类别：PIN Diodes表面贴装：YES
技术：POSITIVE-INTRINSIC-NEGATIVE端子面层：TIN (1969)
端子形式：NO LEAD端子位置：END
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

MA4P7452F-1072T 数据手册

 浏览型号MA4P7452F-1072T的Datasheet PDF文件第2页浏览型号MA4P7452F-1072T的Datasheet PDF文件第3页浏览型号MA4P7452F-1072T的Datasheet PDF文件第4页浏览型号MA4P7452F-1072T的Datasheet PDF文件第5页浏览型号MA4P7452F-1072T的Datasheet PDF文件第6页 
Non Magnetic SMQ MELF PIN Diode  
MA4P7452F-1072  
Rev. V4  
Features  
•
Non-Magnetic Package Suitable for MRI  
Applications  
•
•
•
•
•
•
•
Rectangular MELF SMQ Ceramic Package  
Hermetically Sealed  
Low RS for Low Series Loss  
Long tL for Lower Intermodulation Distortion  
Low CJ for High Series Isolation  
High Average Incident Power Handling  
RoHS* Compliant  
Applications  
•
•
Aerospace & Defense  
ISM  
Description  
The MA4P7452F-1072T is a surface mountable PIN  
diode in a non-magnetic, Metal Electrode Leadless  
Faced (MELF) package. The device incorporates  
Macoms’ time proven HIPAX technology to produce  
a low inductance ceramic package with no ribbons  
or whisker wires. Incorporated in the package is a  
hard glass passivated, CERMACHIP™ PIN chip that  
is full face bonded on both the cathode and anode to  
maximize surface area for the lowest electrical and  
Designed for Automated Assembly  
These SMQ PIN diodes are designed for high  
volume tape and reel assembly. The rectangular  
package design provides for highly efficient  
automatic pick and place assembly techniques. The  
parallel flat surfaces are suitable for key jaw or  
vacuum pickup. All solderable surfaces are tin plated  
and compatible with reflow and vapor phase  
soldering methods.  
thermal resistance. The package utilizes  
a
non-magnetic plating process that provides for a  
package with extremely low permeability. This  
device has been comprehensively characterized  
both electrically and mechanically to ensure  
repeatable & predictable performance. The non-  
magnetic MA4P7452F-1072T is the electrical  
equivalent of its magnetic counterpart the  
MA4P7002F-1072T.  
This diode is well suited for use in low loss, low  
distortion, high power switching circuits and can be  
used in high magnetic field environments at HF  
through UHF frequencies. The low thermal  
resistance of this device provides excellent  
performance at high RF power incident levels, up to  
100 watts CW. This device is designed to meet the  
most demanding electrical and mechanical MRI  
environments.  
Ordering Information  
Part Number  
Package  
MA4P7452F-1072T  
Tape and Reel  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
DC-0007023  
123456

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