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MA4P7006F-1072T PDF预览

MA4P7006F-1072T

更新时间： 2024-11-27 22:58:51
品牌 Logo 应用领域
泰科 - TE 衰减器开关测试二极管
页数 文件大小 规格书
13页 2305K
描述
DIODE PIN SMQ CERAMIC SI

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中文翻译

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MA4P7006F-1072T 技术参数

是否Rohs认证： 符合生命周期：Transferred
零件包装代码：MELF针数：2
Reach Compliance Code：unknownHTS代码：8541.10.00.80
风险等级：5.2其他特性：LOW DISTORTION
应用：ATTENUATOR; SWITCHING配置：SINGLE
最大二极管电容：0.7 pF二极管元件材料：SILICON
最大二极管正向电阻：0.9 Ω二极管类型：PIN DIODE
频带：HIGH FREQUENCY TO ULTRA HIGH FREQUENCYJESD-30 代码：R-CDSO-R2
JESD-609代码：e3少数载流子标称寿命：5 µs
元件数量：1端子数量：2
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装形状：RECTANGULAR
封装形式：SMALL OUTLINE最大功率耗散：3 W
认证状态：Not Qualified表面贴装：YES
技术：POSITIVE-INTRINSIC-NEGATIVE端子面层：TIN
端子形式：WRAP AROUND端子位置：DUAL
Base Number Matches：1

MA4P7006F-1072T 数据手册

 浏览型号MA4P7006F-1072T的Datasheet PDF文件第2页浏览型号MA4P7006F-1072T的Datasheet PDF文件第3页浏览型号MA4P7006F-1072T的Datasheet PDF文件第4页浏览型号MA4P7006F-1072T的Datasheet PDF文件第5页浏览型号MA4P7006F-1072T的Datasheet PDF文件第6页浏览型号MA4P7006F-1072T的Datasheet PDF文件第7页 
MA4P MELF & HIPAX Series  
High Power PIN Diodes  
V16  
Features  
Package Styles  
High Power Handling  
Low Loss / Low Distortion  
Voltage Ratings up to 1000 Volts  
Passivated Chip for Low Leakage Current  
Low Theta (θ) Due to Full Face Chip Bonding  
Leadless Low Inductance MELF Packages  
Various Package Options  
Available as Chips  
Fully RoHS Compliant  
Non-Magnetic Packages Available for MRI  
401 & 402  
1072 & 1091  
Description  
Applications  
The MELF and HIPAX PIN diode series are  
designed for usage in switch and attenuator  
applications requiring high power handling and low  
HIPAX PIN diodes are designed for use in a wide  
variety of switch and attenuator applications from  
HF through UHF frequencies and at power levels  
above 1 kW, CW. The internal chip as well as each  
diode assembly has been comprehensively tested  
and characterized to ensure predictable and  
repeatable performance.  
distortion. These diodes incorporate  
a
fully  
passivated PIN diode chip resulting in an extremely  
low reverse bias leakage current. The  
semiconductor technology utilized in the MELF and  
HIPAX families draws on MACOM ’s substantial  
experience in PIN diode design and wafer  
fabrication. The result is a device which has a thick  
I-region and long carrier lifetime while maintaining  
low series resistance and capacitance values. The  
chips of the MELF and HIPAX PIN diodes are  
enclosed in a rugged ceramic package and is full  
face bonded to metal pins on both the anode and  
cathode. The result is a low loss PIN diode with low  
thermal resistance due to symmetrical thermal  
paths. The parts are offered in either magnetic or  
non-magnetic, HIPAX (axial leaded) or MELF (Metal  
Electrode Leadless Faced) surface mount packages  
for MRI applications. The MELF is a rectangular  
SMQ, package which is designed for high volume  
tape and reel assembly. This easy to use package  
design makes automatic pick and place, indexing  
and assembly, extremely easy. The parallel flat sur-  
faces are suitable for most key jaw or vacuum pick-  
up techniques. All of the solderable surfaces are tin  
plated and compatible with industry standard reflow  
and vapor phase soldering processes. See Applica-  
tion Note M538 for a typical solder reflow profile.  
Design Recommendations  
Low Distortion Attenuators  
MA4P4301B  
Surface Mount Switches  
MA4P7101F  
Cellular Radio Antenna Switches  
MA4P1200, MA4P1250  
Absolute Maximum Ratings  
TA = +25°C (Unless Otherwise Noted)1  
Parameter  
Absolute Maximum  
DC Reverse Voltage (VR)  
(See Tables)  
Operating Chip Junction  
Temperature  
-55°C to +175°C  
Storage Temperature  
Installation Temperature  
ESD  
-55°C to +200°C  
+280°C for 30 Seconds  
Class 1A, HBM  
Many of MACOM’s HIPAX PIN diodes are also  
available as chips. Please consult the “Silicon PIN  
Chip Datasheet” for availability and specifications.  
Notes  
1.Operation of this device above any one of these  
parameters may cause permanent damage.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
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