Datasheet > MA4P7002F-1072T

MA4P7002F-1072T

更新时间： 2024-11-28 11:16:23

品牌	Logo	应用领域
MACOM		衰减器开关二极管
页数	文件大小	规格书
12页	1650K
描述
High Avg. Power SMQ

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MA4P7002F-1072T 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	O-CELF-R2
针数：	2	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8541.10.00.80
风险等级：	0.93	其他特性：	LOW DISTORTION
应用：	ATTENUATOR; SWITCHING	最小击穿电压：	200 V
外壳连接：	ISOLATED	配置：	SINGLE
最大二极管电容：	0.7 pF	标称二极管电容：	0.7 pF
二极管元件材料：	SILICON	最大二极管正向电阻：	0.9 Ω
二极管电阻测试电流：	100 mA	二极管电阻测试频率：	100 MHz
二极管类型：	PIN DIODE	频带：	HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
JESD-30 代码：	O-CELF-R2	少数载流子标称寿命：	3 µs
元件数量：	1	端子数量：	2
最高工作温度：	175 °C	封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装形状：	ROUND	封装形式：	LONG FORM
峰值回流温度（摄氏度）：	NOT SPECIFIED	最大功率耗散：	3 W
认证状态：	Not Qualified	反向测试电压：	100 V
子类别：	PIN Diodes	表面贴装：	YES
技术：	POSITIVE-INTRINSIC-NEGATIVE	端子形式：	WRAP AROUND
端子位置：	END	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

MA4P7002F-1072T 数据手册

MA4P MELF & HIPAX^™Series

High Power PIN Diodes

V14

Package Styles

Features

♦

High Power Handling

Low Loss / Low Distortion

Voltage Ratings up to 1000 Volts

Passivated Chip for Low Leakage Current

Low Theta (θ) Due to Full Face Chip Bonding

Leadless Low Inductance MELF Packages

Various Package Options

Available as Chips

Fully RoHS Compliant

401 & 402

Non-Magnetic Packages Available for MRI

1072 & 1091

Description

Applications

HIPAX PIN diodes are designed for use in a wide

variety of switch and attenuator applications from HF

through UHF frequencies and at power levels above

1kW, CW. The internal chip as well as each diode

assembly has been comprehensively tested and

characterized to ensure predictable and repeatable

performance.

M/A-COM Technology Solutions MELF and HIPAX

PIN diode series are designed for usage in switch

and attenuator applications requiring high power

handling and low distortion. The MELF and HIPAX

PIN diodes incorporate a fully passivated PIN diode

chip resulting in an extremely low reverse bias

leakage current. The semiconductor technology

utilized in the MELF and HIPAX families draws on

M/A-COM Tech’s substantial experience in PIN

diode design and wafer fabrication. The result is a

device which has a thick I-region and long carrier

lifetime while maintaining low series resistance and

capacitance values. The chips of the MELF and

HIPAX PIN diodes are enclosed in a rugged

ceramic package and is full face bonded to metal

pins on both the anode and cathode. The result is a

low loss PIN diode with low thermal resistance due

to symmetrical thermal paths. The parts are offered

in either magnetic or non-magnetic, HIPAX (axial

leaded) or Metal Electrode Leadless Faced (MELF)

surface mount packages for MRI applications. The

MELF is a rectangular SMQ, package which is

designed for high volume tape and reel assembly.

This easy to use package design makes automatic

pick and place, indexing and assembly, extremely

easy. The parallel flat surfaces are suitable for most

key jaw or vacuum pick-up techniques. All of the

solderable surfaces are tin plated and compatible

with industry standard reflow and vapor phase

soldering processes. See page 7 of Application

Note M538 on the M/A-COM Technology Solutions

website for a typical solder reflow profile.

Design Recommendations

♦Low Distortion Attenuators

•MA4P4301B

♦Surface Mount Switches

•MA4P7101F

♦Cellular Radio Antenna Switches

• MA4P1200, MA4P1250

Absolute Maximum Ratings

T_AMB= +25°C (Unless Otherwise Noted) ¹

Parameter

Absolute Maximum

D.C. Reverse Voltage (V_R)

(See Tables)

Operating Chip Junction

Temperature

-55°C to +175°C

Storage Temperature

Installation Temperature

ESD

-55°C to +200°C

+280°C for 30 Seconds

Class 1A, HBM

Notes

1.Operation of this device above any one of these

parameters may cause permanent damage.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• India Tel: +91.80.4155721

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

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