Datasheet > MA4P606-36

MA4P606-36

更新时间： 2024-12-02 14:49:23

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
8页	696K
描述
PIN Diode

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技术参数
数据手册

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MA4P606-36 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	O-CEMW-N2
针数：	2	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8541.10.00.80
风险等级：	5.2	其他特性：	HIGH VOLTAGE, HIGH RELIABILITY, LOW LEAKAGE
应用：	SWITCHING	最小击穿电压：	1000 V
外壳连接：	CATHODE	配置：	SINGLE
最大二极管电容：	0.8 pF	二极管元件材料：	SILICON
最大二极管正向电阻：	0.7 Ω	二极管电阻测试电流：	100 mA
二极管电阻测试频率：	100 MHz	二极管类型：	PIN DIODE
JESD-30 代码：	O-CEMW-N2	少数载流子标称寿命：	4 µs
元件数量：	1	端子数量：	2
最高工作温度：	175 °C	封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装形状：	ROUND	封装形式：	MICROWAVE
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
子类别：	PIN Diodes	表面贴装：	YES
技术：	POSITIVE-INTRINSIC-NEGATIVE	端子形式：	NO LEAD
端子位置：	END	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

MA4P606-36 数据手册

Packaged PIN Diodes

Rev. V15

Features

Co-Axial Packages

•

High Power

Fast Speed

Voltage Ratings to 1500 Volts

Wide Selection of Carrier Lifetimes

Wide Selection of Capacitances

Assortment of Packages Styles

Available Screened for Military Applications

RoHS* Compliant

30, 296

120,255

Leaded/Surface Mount Packages

Description and Applications

Thru Hole

MACOM’s broad line of packaged PIN diodes

encompass a comprehensive range of electrical

characteristics and package outlines. This diverse

union of semiconductor technology and chip

packaging gives considerable flexibility to the circuit

designer. The fast switching series of packaged PIN

diodes utilize a thin I-region, silicon oxide or glass

passivated chip which provides for low leakage

current and low insertion loss.

1088

276

1072,1079

186

1056

144

With the use of in process control monitors to

regulate wafer fabrication parameters, these

devices will achieve consistent performance in

control circuit applications. The high voltage product

line of packaged PIN diodes employs MACOM

CERMACHIP^®passivation process which provides

for a hard glass encapsulation that hermetically

seals and protects the active area of the chip.

Threaded Packages

These packaged CERMACHIP^®PIN diodes are

ideally suited for use in high power applications

where high level RF voltages are present. The diode

chips are bonded into sealed ceramic packages that

are designed for the most stringent electrical and

environmental conditions. An extensive choice of

package styles are available which may be used in a

wide variety of RF microwave circuits.

Maximum Power Dissipation

Package Style

Absolute Maximum P_DISS

T (max. oper.) -25°C

Thermal Resistance

Cathode Heatsink

The packaged PIN diodes series are designed to

have a high inherent reliability and may be ordered

screened to meet many MIL-STD requirements.

Leaded @ +25°C

250 mW

300 mW

Surface Mount @ +25°C

* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0005332

12 3 4 5 6 7 8

中文翻译

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