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MA4P303-1088 PDF预览

MA4P303-1088

更新时间： 2024-11-10 14:49:23
品牌 Logo 应用领域
MACOM /
页数 文件大小 规格书
8页 696K
描述
PIN Diode

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中文翻译

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MA4P303-1088 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：R-CDSO-G2
针数：2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.80
风险等级：5.15其他特性：HIGH VOLTAGE, HIGH RELIABILITY, LOW LEAKAGE
应用：SWITCHING最小击穿电压：200 V
外壳连接：ISOLATED配置：SINGLE
最大二极管电容：0.35 pF二极管元件材料：SILICON
最大二极管正向电阻：1.5 Ω二极管电阻测试电流：10 mA
二极管电阻测试频率：500 MHz二极管类型：PIN DIODE
JESD-30 代码：R-CDSO-G2少数载流子标称寿命：0.2 µs
元件数量：1端子数量：2
最高工作温度：175 °C封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED最大功率耗散：0.25 W
认证状态：Not Qualified子类别：PIN Diodes
表面贴装：YES技术：POSITIVE-INTRINSIC-NEGATIVE
端子形式：GULL WING端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIEDBase Number Matches：1

MA4P303-1088 数据手册

 浏览型号MA4P303-1088的Datasheet PDF文件第2页浏览型号MA4P303-1088的Datasheet PDF文件第3页浏览型号MA4P303-1088的Datasheet PDF文件第4页浏览型号MA4P303-1088的Datasheet PDF文件第5页浏览型号MA4P303-1088的Datasheet PDF文件第6页浏览型号MA4P303-1088的Datasheet PDF文件第7页 
Packaged PIN Diodes  
Packaged PIN Diodes  
Rev. V15  
Features  
Co-Axial Packages  
•
•
•
•
•
•
•
•
High Power  
Fast Speed  
Voltage Ratings to 1500 Volts  
Wide Selection of Carrier Lifetimes  
Wide Selection of Capacitances  
Assortment of Packages Styles  
Available Screened for Military Applications  
RoHS* Compliant  
31  
36  
30, 296  
120,255  
Leaded/Surface Mount Packages  
Description and Applications  
Thru Hole  
MACOM’s broad line of packaged PIN diodes  
encompass a comprehensive range of electrical  
characteristics and package outlines. This diverse  
union of semiconductor technology and chip  
packaging gives considerable flexibility to the circuit  
designer. The fast switching series of packaged PIN  
diodes utilize a thin I-region, silicon oxide or glass  
passivated chip which provides for low leakage  
current and low insertion loss.  
1088  
276  
1072,1079  
186  
1056  
144  
With the use of in process control monitors to  
regulate wafer fabrication parameters, these  
devices will achieve consistent performance in  
control circuit applications. The high voltage product  
line of packaged PIN diodes employs MACOM  
CERMACHIP® passivation process which provides  
for a hard glass encapsulation that hermetically  
seals and protects the active area of the chip.  
Threaded Packages  
These packaged CERMACHIP® PIN diodes are  
ideally suited for use in high power applications  
where high level RF voltages are present. The diode  
chips are bonded into sealed ceramic packages that  
are designed for the most stringent electrical and  
environmental conditions. An extensive choice of  
package styles are available which may be used in a  
wide variety of RF microwave circuits.  
Maximum Power Dissipation  
Package Style  
Absolute Maximum PDISS  
T (max. oper.) -25°C  
Thermal Resistance  
Cathode Heatsink  
The packaged PIN diodes series are designed to  
have a high inherent reliability and may be ordered  
screened to meet many MIL-STD requirements.  
Leaded @ +25°C  
250 mW  
300 mW  
Surface Mount @ +25°C  
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.  
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.  
Visit www.macom.com for additional data sheets and product information.  
For further information and support please visit:  
https://www.macom.com/support  
DC-0005332  
12345678

中文翻译

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