Material Content Data Sheet
Sales Product Name IGB01N120H2
Issued
29. August 2013
1555.99 mg
MA#
MA000375463
PG-TO263-3-2
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
0.824
0.304
0.05
0.02
0.01
19.54
0.01
0.67
7.33
36.43
0.62
0.01
0.00
0.06
0.00
0.00
0.01
0.04
35.20
0.05
530
196
530
leadframe
iron
phosphorus
copper
0.091
59
304.026
0.119
19.57
0.01
195391
77
195646
77
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
10.371
114.086
566.973
9.657
6666
73321
364380
6206
147
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7439-92-1
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
44.43
0.62
444368
6206
leadfinish
plating
nickel
0.228
phosphorus
lead
0.001
0.01
0.06
1
147
595
solder
0.884
568
silver
0.023
15
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
tin
0.019
12
heatspreader
*deviation
phosphorus
iron
0.165
106
0.548
352
copper
547.666
35.25
351973
352431
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com