Material Content Data Sheet
Sales Product Name BFR 183W H6327
Issued
29. August 2013
5.96 mg
MA#
MA000820250
Package
PG-SOT323-3-1
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
noble metal
gold
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
0.003
0.001
0.016
0.001
0.003
0.008
2.617
0.007
0.032
0.679
2.448
0.133
0.010
0.05
0.01
0.26
0.01
0.04
0.13
43.95
0.12
0.53
11.40
41.10
2.23
0.17
454
117
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
tin
silicon
0.32
2641
88
3213
leadframe
silicon
titanium
chromium
copper
gold
441
1324
44.13
0.12
439406
1226
441257
1226
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
5303
114023
411015
22281
1681
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
53.03
2.23
0.17
530342
22281
leadfinish
plating
silver
1681
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com