Material Content Data Sheet
Sales Product Name BAS 16-02V H6327
Issued
29. August 2013
1.67 mg
MA#
MA000762922
PG-SC79-2-1
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
non noble metal
noble metal
arsenic
gold
7440-38-2
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
0.000
0.005
0.017
0.000
0.001
0.002
0.767
0.000
0.007
0.125
0.603
0.055
0.088
0.00
0.30
1.03
0.01
0.05
0.14
45.93
0.00
0.44
7.48
36.07
3.27
5.28
31
3023
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
1.33
10329
92
13383
leadframe
silicon
titanium
chromium
copper
461
1383
459246
1
46.13
0.00
461182
1
wire
copper
encapsulation
carbon black
epoxy resin
silicondioxide
tin
4399
74788
360740
32667
52840
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
43.99
3.27
5.28
439927
32667
leadfinish
plating
silver
52840
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com