是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | 0.200 INCH, PLASTIC, SOP-8 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.57 | Is Samacsys: | N |
最大时钟频率 (fCLK): | 5 MHz | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e0 | 长度: | 5.3 mm |
内存密度: | 262144 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 32768 words |
字数代码: | 32000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 32KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
座面最大高度: | 2.03 mm | 串行总线类型: | SPI |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 5.25 mm |
最长写入周期时间 (tWC): | 5 ms | Base Number Matches: | 1 |
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M95256WMW6G | STMICROELECTRONICS |
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256 Kbit serial SPI bus EEPROM with high-speed clock | |
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256 Kbit Serial SPI bus EEPROM with high speed clock |