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意法半导体 - STMICROELECTRONICS | 内存集成电路光电二极管可编程只读存储器电动程控只读存储器电可擦编程只读存储器时钟 | |
页数 | 文件大小 | 规格书 |
39页 | 581K | |
描述 | ||
256Kbit and 128Kbit Serial SPI Bus EEPROM With High Speed Clock |
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | 0.200 INCH, LEAD FREE, PLASTIC, SO-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.46 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 5 MHz |
数据保留时间-最小值: | 40 | 耐久性: | 100000 Write/Erase Cycles |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 5.3 mm | 内存密度: | 262144 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 32768 words |
字数代码: | 32000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
组织: | 32KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.3 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
电源: | 3/5 V | 认证状态: | Not Qualified |
座面最大高度: | 2.03 mm | 串行总线类型: | SPI |
最大待机电流: | 0.000002 A | 子类别: | EEPROMs |
最大压摆率: | 0.003 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 5.25 mm | 最长写入周期时间 (tWC): | 5 ms |
写保护: | HARDWARE/SOFTWARE | Base Number Matches: | 1 |
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