是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 包装说明: | SOP, SOP8,.25 |
Reach Compliance Code: | compliant | 风险等级: | 5.38 |
Is Samacsys: | N | 数据保留时间-最小值: | 40 |
耐久性: | 1000000 Write/Erase Cycles | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e4 | 内存密度: | 131072 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 端子数量: | 8 |
字数: | 16384 words | 字数代码: | 16000 |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
组织: | 16KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
电源: | 3/5 V | 认证状态: | Not Qualified |
串行总线类型: | SPI | 最大待机电流: | 0.000005 A |
子类别: | EEPROMs | 最大压摆率: | 0.006 mA |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
写保护: | HARDWARE/SOFTWARE | Base Number Matches: | 1 |
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