是否Rohs认证: | 不符合 | 生命周期: | Active |
零件包装代码: | SOIC | 包装说明: | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 |
针数: | 8 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
Factory Lead Time: | 13 weeks | 风险等级: | 2.05 |
Samacsys Confidence: | 3 | Samacsys Status: | Released |
Samacsys PartID: | 179778 | Samacsys Pin Count: | 8 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Small Outline Packages |
Samacsys Footprint Name: | SO8 (150 mils width) | Samacsys Released Date: | 2015-04-13 16:53:12 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 10 MHz |
数据保留时间-最小值: | 40 | 耐久性: | 1000000 Write/Erase Cycles |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e4 |
长度: | 4.9 mm | 内存密度: | 2048 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 256 words |
字数代码: | 256 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 256X8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | SOP8,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
电源: | 3/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.75 mm | 串行总线类型: | SPI |
最大待机电流: | 0.000001 A | 子类别: | EEPROMs |
最大压摆率: | 0.002 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 3.9 mm | 最长写入周期时间 (tWC): | 5 ms |
写保护: | HARDWARE/SOFTWARE | Base Number Matches: | 1 |
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