生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | DIP, | 针数: | 8 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.59 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 2 MHz |
JESD-30 代码: | R-PDIP-T8 | 长度: | 9.27 mm |
内存密度: | 2048 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 128 words |
字数代码: | 128 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 128X16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | DIP | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | SERIAL |
认证状态: | Not Qualified | 座面最大高度: | 5.33 mm |
串行总线类型: | MICROWIRE | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | THROUGH-HOLE |
端子节距: | 2.54 mm | 端子位置: | DUAL |
宽度: | 7.62 mm | 最长写入周期时间 (tWC): | 5 ms |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M93S56-WBN6TG | STMICROELECTRONICS |
获取价格 |
4Kbit, 2Kbit and 1Kbit 16-bit wide MICROWIRE Serial Access EEPROM with Block Protection | |
M93S56-WBN6TP | STMICROELECTRONICS |
获取价格 |
4Kbit, 2Kbit and 1Kbit 16-bit wide MICROWIRE Serial Access EEPROM with Block Protection | |
M93S56-WDS3 | STMICROELECTRONICS |
获取价格 |
4Kbit, 2Kbit and 1Kbit 16-bit wide MICROWIRE Serial Access EEPROM with Block Protection | |
M93S56-WDS3/W | STMICROELECTRONICS |
获取价格 |
IC,SERIAL EEPROM,128X16,CMOS,TSSOP,8PIN,PLASTIC | |
M93S56-WDS3G | STMICROELECTRONICS |
获取价格 |
4Kbit, 2Kbit and 1Kbit 16-bit wide MICROWIRE Serial Access EEPROM with Block Protection | |
M93S56-WDS3G/W | STMICROELECTRONICS |
获取价格 |
IC,SERIAL EEPROM,128X16,CMOS,TSSOP,8PIN,PLASTIC | |
M93S56-WDS3P | STMICROELECTRONICS |
获取价格 |
4Kbit, 2Kbit and 1Kbit 16-bit wide MICROWIRE Serial Access EEPROM with Block Protection | |
M93S56-WDS3P/W | STMICROELECTRONICS |
获取价格 |
IC,SERIAL EEPROM,128X16,CMOS,TSSOP,8PIN,PLASTIC | |
M93S56-WDS3T | STMICROELECTRONICS |
获取价格 |
4Kbit, 2Kbit and 1Kbit 16-bit wide MICROWIRE Serial Access EEPROM with Block Protection | |
M93S56-WDS3T/W | STMICROELECTRONICS |
获取价格 |
IC,SERIAL EEPROM,128X16,CMOS,TSSOP,8PIN,PLASTIC |