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M74HC670P PDF预览

M74HC670P

更新时间: 2024-12-01 09:55:43
品牌 Logo 应用领域
三菱 - MITSUBISHI 光电二极管
页数 文件大小 规格书
7页 343K
描述
Memory IC, CMOS, PDIP16

M74HC670P 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP16,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-PDIP-T16
JESD-609代码:e0端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP16,.3封装形状:RECTANGULAR
封装形式:IN-LINE电源:2/6 V
认证状态:Not Qualified子类别:Other Memory ICs
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUALBase Number Matches:1

M74HC670P 数据手册

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