品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 解复用器 | |
页数 | 文件大小 | 规格书 |
11页 | 245K | |
描述 | ||
DUAL 4:1 CHANNEL ANALOG MUX/DEMUX WITH INJECTION CURRENT PROTECTION |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSSOP | 包装说明: | TSSOP, TSSOP16,.25 |
针数: | 16 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.75 |
模拟集成电路 - 其他类型: | DIFFERENTIAL MULTIPLEXER | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e4 | 长度: | 5 mm |
湿度敏感等级: | 3 | 信道数量: | 4 |
功能数量: | 1 | 端子数量: | 16 |
通态电阻匹配规范: | 2 Ω | 最大通态电阻 (Ron): | 280 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP16,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2/6 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 0.04 mA | 最大供电电压 (Vsup): | 6 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 最长断开时间: | 90 ns |
最长接通时间: | 90 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 4.4 mm |
Base Number Matches: | 1 |
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