品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 静态存储器 | |
页数 | 文件大小 | 规格书 |
20页 | 151K | |
描述 | ||
32KX8 STANDARD SRAM, 70ns, PDSO28, 8 X 13.40 MM, PLASTIC, TSOP-28 |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP | 包装说明: | 8 X 13.40 MM, PLASTIC, TSOP-28 |
针数: | 28 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.41 |
风险等级: | 5.82 | Is Samacsys: | N |
最长访问时间: | 70 ns | I/O 类型: | COMMON |
JESD-30 代码: | R-PDSO-G28 | JESD-609代码: | e0 |
长度: | 11.8 mm | 内存密度: | 262144 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 28 |
字数: | 32768 words | 字数代码: | 32000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 32KX8 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP1 | 封装等效代码: | TSSOP28,.53,22 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3/3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.25 mm | 最大待机电流: | 0.000006 A |
最小待机电流: | 1.5 V | 子类别: | SRAMs |
最大压摆率: | 0.03 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | GULL WING | 端子节距: | 0.55 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
CY62256VNLL-70ZXET | CYPRESS |
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