品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 内存集成电路 | |
页数 | 文件大小 | 规格书 |
60页 | 911K | |
描述 | ||
32 Mbit (1Mb x32, Boot Block, Burst) 3.3V Supply Flash Memory |
生命周期: | Transferred | 零件包装代码: | QFP |
包装说明: | PLASTIC, QFP-80 | 针数: | 80 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.1.A |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.49 |
最长访问时间: | 60 ns | 其他特性: | SYNCHRONOUS BURST MODE OPERATION POSSIBLE; BOTTOM BOOT BLOCK |
启动块: | BOTTOM | 命令用户界面: | YES |
通用闪存接口: | YES | 数据轮询: | NO |
JESD-30 代码: | R-PQFP-G80 | 长度: | 20 mm |
内存密度: | 33554432 bit | 内存集成电路类型: | FLASH |
内存宽度: | 32 | 功能数量: | 1 |
部门数/规模: | 4,8,62 | 端子数量: | 80 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 1MX32 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QFP |
封装等效代码: | QFP80,.7X.9,32 | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 页面大小: | 4 words |
并行/串行: | PARALLEL | 电源: | 3.3 V |
编程电压: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 3.4 mm | 部门规模: | 4K,2K,16K |
最大待机电流: | 0.0001 A | 子类别: | Flash Memories |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子形式: | GULL WING | 端子节距: | 0.8 mm |
端子位置: | QUAD | 切换位: | NO |
类型: | NOR TYPE | 宽度: | 14 mm |
Base Number Matches: | 1 |
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32 Mbit (1Mb x32, Boot Block, Burst) 3.3V Supply Flash Memory | |
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32 Mbit (1Mb x32, Boot Block, Burst) 3.3V Supply Flash Memory | |
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