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M58BW032BB55ZA6T PDF预览

M58BW032BB55ZA6T

更新时间: 2024-11-18 22:46:39
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存存储内存集成电路
页数 文件大小 规格书
60页 911K
描述
32 Mbit (1Mb x32, Boot Block, Burst) 3.3V Supply Flash Memory

M58BW032BB55ZA6T 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:10 X 8 MM, 1 MM PITCH, LBGA-80针数:80
Reach Compliance Code:unknownECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.49
Is Samacsys:N最长访问时间:55 ns
其他特性:SYNCHRONOUS BURST MODE OPERATION POSSIBLE; BOTTOM BOOT BLOCK启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B80
长度:12 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:32
功能数量:1部门数/规模:4,8,62
端子数量:80字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX32封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA80,8X10,40
封装形状:RECTANGULAR封装形式:GRID ARRAY
页面大小:4 words并行/串行:PARALLEL
电源:3.3 V编程电压:3.3 V
认证状态:Not Qualified座面最大高度:1.7 mm
部门规模:4K,2K,16K最大待机电流:0.0001 A
子类别:Flash Memories最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
切换位:NO类型:NOR TYPE
宽度:10 mmBase Number Matches:1

M58BW032BB55ZA6T 数据手册

 浏览型号M58BW032BB55ZA6T的Datasheet PDF文件第2页浏览型号M58BW032BB55ZA6T的Datasheet PDF文件第3页浏览型号M58BW032BB55ZA6T的Datasheet PDF文件第4页浏览型号M58BW032BB55ZA6T的Datasheet PDF文件第5页浏览型号M58BW032BB55ZA6T的Datasheet PDF文件第6页浏览型号M58BW032BB55ZA6T的Datasheet PDF文件第7页 
M58BW032BT, M58BW032BB  
M58BW032DT, M58BW032DB  
32 Mbit (1Mb x32, Boot Block, Burst)  
3.3V Supply Flash Memory  
PRELIMINARY DATA  
FEATURES SUMMARY  
SUPPLY VOLTAGE  
Figure 1. Packages  
VDD = 3.0V to 3.6V for Program, Erase  
and Read  
VDDQ = VDDQIN = 1.6V to 3.6V for I/O  
Buffers  
HIGH PERFORMANCE  
Access Time: 45, 55 and 60ns  
75MHz Effective Zero Wait-State Burst  
Read  
PQFP80 (T)  
Synchronous Burst Reads  
Asynchronous Page Reads  
MEMORY ORGANIZATION  
– Eight 64 Kbit small parameter Blocks  
BGA  
– Four 128Kbit large parameter Blocks (of  
which one is OTP)  
– Sixty-two 512Kbit main Blocks  
LBGA80 (ZA)  
10 x 8 ball array  
HARDWARE BLOCK PROTECTION  
WP pin Lock Program and Erase  
VPEN signal for Program/Erase Enable  
SOFTWARE BLOCK PROTECTION  
ELECTRONIC SIGNATURE  
Tuning Protection to Lock Program and  
Erase with 64-bit User Programmable  
Password (M58BW032B version only)  
Manufacturer Code: 20h  
Top Device Code M58BW032xT: 8838h  
Bottom Device Code M58BW032xB:  
8837h  
SECURITY  
64-bit Unique Device Identifier (UID)  
OPERATING TEMPERATURE RANGE  
FAST PROGRAMMING  
Automotive (Grade 3): 40 to 125°C  
Industrial (Grade 6): 40 to 90°C  
Write to Buffer and Program capability  
OPTIMIZED FOR FDI DRIVERS  
Common Flash Interface (CFI)  
Fast Program/Erase Suspend feature in  
each block  
LOW POWER CONSUMPTION  
100µA Typical Standby  
November 2004  
1/60  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.  

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