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M52S16161A-10TG PDF预览

M52S16161A-10TG

更新时间: 2024-11-20 03:05:07
品牌 Logo 应用领域
晶豪 - ESMT 存储内存集成电路光电二极管动态存储器
页数 文件大小 规格书
29页 755K
描述
512K x 16Bit x 2Banks Synchronous DRAM

M52S16161A-10TG 技术参数

生命周期:Contact Manufacturer零件包装代码:TSOP2
包装说明:TSOP2,针数:50
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.72
访问模式:DUAL BANK PAGE BURST最长访问时间:9 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G50
长度:20.95 mm内存密度:16777216 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:50字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL宽度:10.16 mm
Base Number Matches:1

M52S16161A-10TG 数据手册

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ESMT  
M52S16161A  
SDRAM  
512K x 16Bit x 2Banks  
Synchronous DRAM  
FEATURES  
GENERAL DESCRIPTION  
The M52S16161A is 16,777,216 bits synchronous high  
data rate Dynamic RAM organized as 2 x 524,288 words by  
16 bits, fabricated with high performance CMOS technology.  
Synchronous design allows precise cycle control with the  
use of system clock I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst length and programmable latencies allow the same  
device to be useful for a variety of high bandwidth, high  
performance memory system applications.  
z
z
z
z
2.5V power supply  
LVCMOS compatible with multiplexed address  
Dual banks operation  
MRS cycle with address key programs  
-
-
-
CAS Latency (1, 2 & 3 )  
Burst Length (1, 2, 4, 8 & full page)  
Burst Type (Sequential & Interleave)  
z
z
EMRS cycle with address key programs.  
All inputs are sampled at the positive going edge of the  
system clock  
z
z
Burst Read Single-bit Write operation  
Special Function Support.  
ORDERING INFORMATION  
-
-
-
PASR (Partial Array Self Refresh )  
TCSR (Temperature compensated Self Refresh)  
DS (Driver Strength)  
MAX  
Freq.  
Part NO.  
Interface Package Comments  
50  
M52S16161A-8TG 125MHz LVCMOS  
M52S16161A-10TG 100MHz LVCMOS  
M52S16161A-8BG 125MHz LVCMOS  
M52S16161A-10BG 100MHz LVCMOS  
Pb-free  
Pb-free  
Pb-free  
Pb-free  
z
z
z
DQM for masking  
Auto & self refresh  
32ms refresh period (2K cycle)  
TSOP(II)  
50  
TSOP(II)  
60 Ball  
VFBGA  
60 Ball  
VFBGA  
PIN CONFIGURATION (TOP VIEW)  
1
2
3
4
5
6
7
VDD  
1
VSS  
DQ0  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
DQ15  
VDD  
A
B
VSS  
DQ0  
DQ1  
VSSQ  
DQ2  
DQ3  
VDDQ  
DQ4  
DQ5  
VSSQ  
DQ6  
DQ7  
VDDQ  
LDQM  
WE  
2
DQ15  
DQ14  
VSSQ  
DQ13  
DQ12  
VDDQ  
DQ11  
DQ10  
VSSQ  
DQ9  
DQ8  
VDDQ  
N.C/RFU  
UDQM  
CLK  
CKE  
N.C  
VDDQ  
VSSQ  
DQ1  
DQ2  
DQ14  
DQ13  
VSSQ  
VDDQ  
3
4
C
D
E
F
5
6
DQ4  
DQ3  
DQ5  
DQ12  
DQ10  
DQ9  
DQ11  
7
VDDQ  
VSSQ  
8
9
VSSQ  
NC  
VDDQ  
NC  
DQ6  
DQ7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
G
H
J
DQ8  
NC  
NC  
NC  
NC  
NC  
WE  
UDQM  
LDQM  
CAS  
RAS  
CS  
NC  
CLK  
NC  
RAS  
NC  
CAS  
CS  
K
L
CKE  
BA  
A9  
A9  
A7  
NC  
A0  
NC  
BA  
A8  
M
N
P
R
A10/AP  
A0  
A8  
A7  
A10  
A1  
A6  
A1  
A2  
A5  
A6  
A5  
A4  
A2  
A3  
A3  
A4  
50PIN TSOP(II)  
(400mil x 825mil)  
(0.8 mm PIN PITCH)  
60 Ball VFBGA  
(6.4x10.1mm)  
(0.65mm ball pitch)  
VSS  
VDD  
VDD  
VSS  
Elite Semiconductor Memory Technology Inc.  
Publication Date : May. 2007  
Revision : 1.5 1/29  

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