ESMT
M52L64164A
Operation Temperature Condition -40~85°C
Mobile SDRAM
1M x 16 Bit x 4 Banks
Synchronous DRAM
FEATURES
ORDERING INFORMATION
y
y
y
y
3.3V power supply
LVTTL compatible with multiplexed address
Four banks operation
MRS cycle with address key programs
- CAS Latency (2 & 3)
- Burst Length (1, 2, 4, 8 & full page)
- Burst Type (Sequential & Interleave)
EMRS cycle with address
MAX
PRODUCT NO.
PACKAGE Comments
FREQ.
M52L64164A-6TIG
M52 L64164A-7TIG
166MHz 54 Pin TSOP II
143MHz 54 Pin TSOP II
Pb-free
Pb-free
y
y
M52L64164A-6BIG
M52L64164A-7BIG
166MHz 54 Ball BGA
143MHz 54 Ball BGA
Pb-free
Pb-free
All inputs are sampled at the positive going edge of the
system clock
y
Special function support
-
-
-
PASR (Partial Array Self Refresh)
TCSR (Temperature Compensated Self Refresh)
DS (Driver Strength)
y
y
y
DQM for masking
Auto & self refresh
64ms refresh period (4K cycle)
GENERAL DESCRIPTION
The M52L64164A is 67,108,864 bits synchronous high data rate Dynamic RAM organized as 4 x 1,048,576 words by
16 bits. Synchronous design allows precise cycle controls with the use of system clock I/O transactions are possible on
every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same
device to be useful for a variety of high bandwidth, high performance memory system applications.
PIN ASSIGNMENT (Top View)
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
1
2
3
4
5
6
7
8
9
54
53 DQ15
52
VSS
1
2
3
4
5
6
7
8
9
VSSQ
VDDQ
DQ0
VDD
A
B
C
D
E
F
VSS
DQ15
VSSQ
51 DQ14
50 DQ13
VDDQ
VSSQ
VSSQ
VDDQ
DQ2
DQ4
DQ1
DQ3
DQ14
DQ12
DQ13
DQ11
49
48
VDDQ
DQ12
47 DQ11
46
VSSQ
VSSQ
VDD
DQ6
DQ10
DQ8
DQ9
NC
VDDQ
VSS
DQ5
DQ7
45 DQ10
44 DQ9
DQ5 10
DQ6 11
LDQM
43
42 DQ8
41
VDDQ
VSSQ
12
DQ7 13
14
VSS
VDD
UDQM
NC
CLK
A11
CKE
A9
CAS
BA0
RAS
BA1
WE
CS
LDQM 15
WE 16
40 NC
39 UDQM
38 CLK
37 CKE
36 NC
G
H
J
CAS 17
RAS 18
CS 19
A8
A0
A3
A10
A7
A5
A6
A4
A1
A2
35
34
33
32
31
30
29
28
A11
A9
BA0 20
BA1 21
A10/AP 22
VSS
VDD
A8
A0
A1
23
24
25
26
27
A7
A6
A2
A5
A4
A3
VDD
VSS
Elite Semiconductor Memory Technology Inc.
Publication Date: Sep. 2008
Revision: 1.1 1/47