品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 闪存 | |
页数 | 文件大小 | 规格书 |
36页 | 260K | |
描述 | ||
2MX8 FLASH 3V PROM, 11ns, PDSO40, 10 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-40 |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP | 包装说明: | 10 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-40 |
针数: | 40 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.47 | 最长访问时间: | 11 ns |
启动块: | TOP | 命令用户界面: | YES |
数据轮询: | NO | JESD-30 代码: | R-PDSO-G40 |
JESD-609代码: | e3 | 长度: | 18.4 mm |
内存密度: | 16777216 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
部门数/规模: | 1,2,1,30,16 | 端子数量: | 40 |
字数: | 2097152 words | 字数代码: | 2000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -20 °C | 组织: | 2MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1 |
封装等效代码: | TSSOP40,.8,20 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 部门规模: | 16K,8K,32K,64K,4K |
最大待机电流: | 0.0001 A | 子类别: | Flash Memories |
最大压摆率: | 0.06 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | TIN |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
切换位: | NO | 类型: | NOR TYPE |
宽度: | 10 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
M50LPW116N5G | STMICROELECTRONICS |
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型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M50LPW80K1G | NUMONYX |
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M50LPW80N1G | NUMONYX |
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M50LPW80N1TG | NUMONYX |
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