生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LFBGA, | 针数: | 66 |
Reach Compliance Code: | unknown | HTS代码: | 8542.32.00.71 |
风险等级: | 5.12 | Is Samacsys: | N |
其他特性: | STATIC RAM IS ORGANIZED AS 256K X 16 | JESD-30 代码: | R-PBGA-B66 |
JESD-609代码: | e0 | 长度: | 12 mm |
内存密度: | 33554432 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 66 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 2MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大供电电压 (Vsup): | 3.3 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M36W432B70ZA6 | STMICROELECTRONICS |
获取价格 |
暂无描述 | |
M36W432B70ZA6T | STMICROELECTRONICS |
获取价格 |
32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product | |
M36W432B70ZA6T | NUMONYX |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | |
M36W432B85ZA1 | STMICROELECTRONICS |
获取价格 |
IC,MIXED MEMORY,FLASH+SRAM,CMOS,BGA,66PIN,PLASTIC | |
M36W432B85ZA1T | STMICROELECTRONICS |
获取价格 |
32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product | |
M36W432B85ZA6 | STMICROELECTRONICS |
获取价格 |
暂无描述 | |
M36W432B85ZA6T | STMICROELECTRONICS |
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32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product | |
M36W432BG | STMICROELECTRONICS |
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32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256Kb x16 SRAM, Multiple Memory Produc | |
M36W432BG70ZA1 | STMICROELECTRONICS |
获取价格 |
SPECIALTY MEMORY CIRCUIT, PBGA66, 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 | |
M36W432BG70ZA1T | STMICROELECTRONICS |
获取价格 |
32 Mbit 2Mb x16, Boot Block Flash Memory and 4 Mbit 256Kb x16 SRAM, Multiple Memory Produc |