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M36W0R6050T3ZAQF PDF预览

M36W0R6050T3ZAQF

更新时间: 2024-11-19 03:29:43
品牌 Logo 应用领域
恒忆 - NUMONYX 闪存存储内存集成电路静态存储器
页数 文件大小 规格书
23页 469K
描述
64-Mbit (4 Mbits 】16, multiple bank, burst) Flash memory and 16-Mbit (1 Mbit 】16) or 32-Mbit (2 Mbits x16) PSRAM MCP

M36W0R6050T3ZAQF 技术参数

是否Rohs认证:符合生命周期:Transferred
零件包装代码:BGA包装说明:TFBGA, BGA88,8X12,32
针数:88Reach Compliance Code:unknown
HTS代码:8542.32.00.71风险等级:5.2
Is Samacsys:N最长访问时间:70 ns
其他特性:SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 2M X 16JESD-30 代码:R-PBGA-B88
长度:10 mm内存密度:67108864 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:16
混合内存类型:FLASH+PSRAM功能数量:1
端子数量:88字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-30 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA88,8X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.8 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.00011 A子类别:Other Memory ICs
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mmBase Number Matches:1

M36W0R6050T3ZAQF 数据手册

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M36P0R9070E0  
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory  
128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package  
Feature summary  
FBGA  
Multi-Chip Package  
– 1 die of 512 Mbit (32Mb x 16, Multiple  
Bank, Multi-Level, Burst) Flash Memory  
– 1 die of 128Mbit (8Mb x16) PSRAM  
Supply voltage  
TFBGA107 (ZAC)  
– V  
– V  
= V  
= V  
= 1.7 to 1.95V  
DDQ  
DDF  
PPF  
CCP  
= 9V for fast program  
Block locking  
Electronic signature  
– Manufacturer Code: 20h  
– Device Code: 8819  
– All Blocks locked at power-up  
– Any combination of Blocks can be locked  
with zero latency  
ECOPACK® package available  
– WP for Block Lock-Down  
F
– Absolute Write Protection with V  
= V  
SS  
PPF  
Flash memory  
PSRAM  
Synchronous / Asynchronous Read  
– Synchronous Burst Read mode:  
108MHz, 66MHz  
– Asynchronous Page Read mode  
– Random Access: 96ns  
Access time: 70ns  
User-selectable operating modes  
– Asynchronous modes: Random Read, and  
Write, Page Read  
Programming time  
– Synchronous modes: NOR-Flash, Full  
Synchronous (Burst Read and Write)  
– 4.2µs typical Word program time using  
Buffer Enhanced Factory Program  
command  
Asynchronous Page Read  
– Page Size: 4, 8 or 16 Words  
– Subsequent Read Within Page: 20ns  
Memory organization  
– Multiple bank memory array: 64 Mbit banks  
Burst Read  
– Four Extended Flash Array (EFA) Blocks of  
64 Kbits  
– Fixed Length (4, 8, 16 or 32 Words) or  
Continuous  
Dual operations  
– Maximum Clock Frequency: 80MHz  
– program/erase in one Bank while read in  
others  
– No delay between read and write  
operations  
Low Power Consumption  
– Active Current: < 25mA  
– Standby Current: 200µA  
– Deep Power-Down Current: 10µA  
Security  
Low Power Features  
– 2112-bit user programmable OTP Cells  
– 64-bit unique device number  
– Partial Array Self Refresh (PASR)  
– Deep Power-Down (DPD) Mode  
100,000 program/erase cycles per block  
Common Flash Interface (CFI)  
November 2007  
Rev 3  
1/23  
www.numonyx.com  
1

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