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M36P0R8070E0ZACF PDF预览

M36P0R8070E0ZACF

更新时间: 2024-09-28 03:32:03
品牌 Logo 应用领域
恒忆 - NUMONYX 闪存静态存储器
页数 文件大小 规格书
22页 639K
描述
256 Mbit (x16, multiple bank, multilevel, burst) Flash memory 128 Mbit (burst) PSRAM, 1.8 V supply, multichip package

M36P0R8070E0ZACF 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BGA包装说明:TFBGA, BGA107,9X12,32
针数:107Reach Compliance Code:unknown
HTS代码:8542.32.00.71风险等级:5.44
最长访问时间:93 ns其他特性:SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 8M X 16
JESD-30 代码:R-PBGA-B107长度:11 mm
内存密度:268435456 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16混合内存类型:FLASH+PSRAM
功能数量:1端子数量:107
字数:16777216 words字数代码:16000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-30 °C组织:16MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA107,9X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.8 V认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Other Memory ICs
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:8 mm

M36P0R8070E0ZACF 数据手册

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M36P0R8070E0  
256 Mbit (x16, multiple bank, multilevel, burst) Flash memory  
128 Mbit (burst) PSRAM, 1.8 V supply, multichip package  
Features  
Multichip package  
– 1 die of 256 Mbit (16 Mb x 16, multiple  
bank, multilevel, burst) Flash memory  
FBGA  
– 1 die of 128 Mbit (8 Mb x16) PSRAM  
Supply voltage  
– V  
– V  
= V  
= V  
= 1.7 to 1.95 V  
DDQ  
TFBGA107 (ZAC)  
DDF  
PPF  
CCP  
= 9 V for fast program (12 V tolerant)  
Electronic signature  
– Manufacturer code: 20h  
– Device code: 8818  
Block locking  
Package  
– All blocks locked at power-up  
– ECOPACK®  
– Any combination of blocks can be locked  
with zero latency  
Flash memory  
Synchronous/asynchronous read  
– WP for block lock-down  
F
– Synchronous burst read mode:  
108 MHz, 66 MHz  
– Absolute write protection with V  
= V  
PPF SS  
CFI (common Flash interface)  
– Asynchronous page read mode  
– Random access: 93 ns  
PSRAM  
Access time: 70 ns  
Programming time  
Asynchronous page read  
– 4 µs typical Word program time using  
Buffer Enhanced Factory Program  
command  
– Page size: 4, 8 or 16 words  
– Subsequent read within page: 20 ns  
Memory organization  
Synchronous burst read/write  
– Multiple bank memory array: 32 Mbit banks  
– Four EFA (extended flash array) blocks of  
64 Kbits  
Low power consumption  
– Active current: < 25 mA  
– Standby current: 200 µA  
– Deep power-down current: 10 µA  
Dual operations  
– Program/erase in one bank while read in  
others  
Low power features  
PASR (partial array self refresh)  
– DPD (deep power-down) mode  
– No delay between read and write  
operations  
Security  
– 64bit unique device number  
– 2112 bit user programmable OTP Cells  
100 000 program/erase cycles per block  
December 2007  
Rev 2  
1/22  
www.numonyx.com  
1

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