品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | / | |
页数 | 文件大小 | 规格书 |
83页 | 1370K | |
描述 | ||
256 Mbit (16Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Flash Memory |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 |
针数: | 88 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.42 | 最长访问时间: | 85 ns |
其他特性: | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | 启动块: | TOP |
命令用户界面: | YES | 通用闪存接口: | YES |
数据轮询: | NO | JESD-30 代码: | R-PBGA-B88 |
JESD-609代码: | e1 | 长度: | 10 mm |
内存密度: | 268435456 bit | 内存集成电路类型: | FLASH |
内存宽度: | 16 | 功能数量: | 1 |
部门数/规模: | 4,255 | 端子数量: | 88 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 组织: | 16MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装等效代码: | BGA88,8X12,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 页面大小: | 8 words |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8 V | 编程电压: | 1.8 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
部门规模: | 16K,64K | 最大待机电流: | 0.000005 A |
子类别: | Flash Memories | 最大压摆率: | 0.052 mA |
最大供电电压 (Vsup): | 2 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 切换位: | NO |
类型: | NOR TYPE | 宽度: | 8 mm |
Base Number Matches: | 1 |
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