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M30L0R8000B2ZAQF PDF预览

M30L0R8000B2ZAQF

更新时间: 2024-10-28 20:36:11
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 可编程只读存储器内存集成电路闪存
页数 文件大小 规格书
109页 852K
描述
16MX16 FLASH 1.8V PROM, 85ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88

M30L0R8000B2ZAQF 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BGA包装说明:8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88
针数:88Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.38最长访问时间:85 ns
其他特性:SYNCHRONOUS BURST MODE OPERATION POSSIBLE启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B88
长度:10 mm内存密度:268435456 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:4,255
端子数量:88字数:16777216 words
字数代码:16000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:16MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA88,8X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
页面大小:8 words并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.8 V
编程电压:1.8 V认证状态:Not Qualified
座面最大高度:1.2 mm部门规模:16K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.077 mA最大供电电压 (Vsup):2 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:NO
类型:NOR TYPE宽度:8 mm
Base Number Matches:1

M30L0R8000B2ZAQF 数据手册

 浏览型号M30L0R8000B2ZAQF的Datasheet PDF文件第2页浏览型号M30L0R8000B2ZAQF的Datasheet PDF文件第3页浏览型号M30L0R8000B2ZAQF的Datasheet PDF文件第4页浏览型号M30L0R8000B2ZAQF的Datasheet PDF文件第5页浏览型号M30L0R8000B2ZAQF的Datasheet PDF文件第6页浏览型号M30L0R8000B2ZAQF的Datasheet PDF文件第7页 
M30L0R8000T2  
M30L0R8000B2  
256 Mbit (×16, multiple bank, multilevel, burst)  
1.8 V supply Flash memory  
Features  
Supply voltage  
– V = 1.7 V to 2.0 V for program, erase  
DD  
and read  
FBGA  
– V  
= 1.7 V to 2.0 V for I/O buffers  
DDQ  
– V = 9 V for fast program  
PP  
Synchronous/asynchronous read  
– Synchronous burst read mode: 54 MHz  
– Asynchronous page read  
TFBGA88 (ZAQ) 8 × 10 mm  
– Random access: 85 ns  
Synchronous burst read suspend  
Programming time  
– 5 µs typical word program time using Buffer  
Enhanced Factory Program command  
100 000 program/erase cycles per block  
Electronic signature  
Memory organization  
– Manufacturer code: 20h  
– Multiple bank memory array:  
16 Mbit banks  
Top device code:  
M30L0R8000T2: 880Dh  
Bottom device code  
– Parameter blocks (top or bottom location)  
M30L0R8000B2: 880Eh  
Dual operations  
– Program/erase in one bank while read in  
others  
TFBGA88 package  
– ECOPACK®  
– No delay between read and write  
operations  
Block locking  
– All blocks locked at power-up  
– Any combination of blocks can be locked  
with zero latency  
– WP for block lock-down  
– Absolute write protection with V = V  
PP  
SS  
Security  
– 64 bit unique device number  
– 2112 bit user programmable OTP Cells  
CFI (common Flash interface)  
October 2007  
Rev. 1  
1/109  
www.st.com  
1

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