是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | 7 X 11 MM, 0.80 MM PITCH, TFBGA-63 |
针数: | 63 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.42 | Is Samacsys: | N |
最长访问时间: | 70 ns | JESD-30 代码: | R-PBGA-B63 |
JESD-609代码: | e0 | 长度: | 11 mm |
内存密度: | 67108864 bit | 内存集成电路类型: | FLASH |
内存宽度: | 16 | 功能数量: | 1 |
端子数量: | 63 | 字数: | 4194304 words |
字数代码: | 4000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 4MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 编程电压: | 3 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn63Pb37) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 类型: | NOR TYPE |
宽度: | 7 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M29W641DU70ZA6 | NUMONYX |
获取价格 |
暂无描述 | |
M29W641DU70ZA6E | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU70ZA6F | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU70ZA6T | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU90N1E | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU90N1F | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU90N1T | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU90N6E | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU90N6F | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory | |
M29W641DU90N6T | STMICROELECTRONICS |
获取价格 |
64 Mbit 4Mb x16, Uniform Block 3V Supply Flash Memory |