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M29W640GT70ZA6F PDF预览

M29W640GT70ZA6F

更新时间: 2024-03-03 10:08:01
品牌 Logo 应用领域
镁光 - MICRON /
页数 文件大小 规格书
74页 966K
描述
64Mb (8Mb x8 or 4Mb x16), Uniform Block or Boot Block, Parallel NOR Flash Memory

M29W640GT70ZA6F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA, BGA48,6X8,32针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.48
Is Samacsys:N最长访问时间:70 ns
其他特性:TOP BOOT BLOCK备用内存宽度:8
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:8 mm内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:8,127
端子数量:48字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA48,6X8,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
页面大小:4/8 words并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:8K,64K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.02 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:6 mm
Base Number Matches:1

M29W640GT70ZA6F 数据手册

 浏览型号M29W640GT70ZA6F的Datasheet PDF文件第2页浏览型号M29W640GT70ZA6F的Datasheet PDF文件第3页浏览型号M29W640GT70ZA6F的Datasheet PDF文件第4页浏览型号M29W640GT70ZA6F的Datasheet PDF文件第5页浏览型号M29W640GT70ZA6F的Datasheet PDF文件第6页浏览型号M29W640GT70ZA6F的Datasheet PDF文件第7页 
64Mb: 3V Embedded Parallel NOR Flash  
Features  
Parallel NOR Flash Embedded Memory  
M29W640GH, M29W640GL  
M29W640GT, M29W640GB  
• Common Flash interface  
– 64-bit security code  
Features  
• Supply voltage  
– VCC = 2.7–3.6V (program, erase, read)  
– VPP = 12V for fast program (optional)  
• Asynchronous random/page read  
– Page width: 4 words  
– Page access: 25ns  
– Random access: 60ns, 70ns, 90ns  
• Fast program commands  
• 128-word extended memory block  
– Extra block used as security block or to store ad-  
ditional information  
• Low power consumption: Standby and automatic  
mode  
• 100,000 PROGRAM/ERASE cycles per block  
• Electronic signature  
– Manufacturer code: 0020h  
– 2-word/4-byte program (without VPP = 12V)  
– 4-word/8-byte program (with VPP = 12V)  
– 16-word/32-byte write buffer  
• Programming time  
• Device summary: part number and device code  
– M29W640GH: uniform, last block protected by  
VPP/WP#  
– 227Eh + 220Ch + 2201h  
– M29W640GL: uniform, first block protected by  
VPP/WP#  
– 227Eh + 220Ch + 2200h  
– M29W640GT: top boot block  
– 227Eh + 2210h + 2201h  
– M29W640GB: bottom boot block  
– 227Eh + 2210h + 2200h  
• RoHS-compliant packages  
– 10µs per byte/word TYP  
– Chip program time: 10 s (4-word program)  
– Double word/quadruple byte program  
• Memory organization  
– M29W640GH/L 128 main blocks, 64KB each  
– M29W640GT/B 127 main blocks, 64KB each and  
8 boot blocks, 8KB each  
• Program/erase controller  
– Embedded byte/word program algorithms  
• Program/erase suspend and resume  
– Read from any block during a PROGRAM SUS-  
PEND operation  
– Read or program another block during an ERASE  
SUSPEND operation  
– 48-pin TSOP (N/NA) 12mm x 20mm  
– 56-pin TSOP (NB) 14mm x 20mm  
– 48-ball TFBGA (ZA) 6mm x 8mm  
– 64-ball FBGA (ZS) 11mm x 13mm  
– 64-ball TBGA (ZF) 10mm x 13mm  
• Automotive certified parts available  
• Hardware block protection  
– VPP/WP# pin for fast program and write protect  
Temporary block unprotect mode  
Part Numbering Information  
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory  
content bits erased to 1. For available options, such as packages or speed, or for further information, contact your  
Micron sales representative. Part numbers can be verified at www.micron.com. Feature and specification compari-  
son by device type is available at www.micron.com/products. Contact the factory for devices not found.  
Table 1: Part Number Information  
Part Number  
Category  
Category Details  
Device Type  
M29 = Parallel Flash memory  
PDF: 09005aef84e35115  
m29W_640GH/L_GT/B.pdf - Rev. E 02/18 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
© 2013 Micron Technology, Inc. All rights reserved.  
1
Products and specifications discussed herein are subject to change by Micron without notice.  

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