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M29W256GL70ZA6F PDF预览

M29W256GL70ZA6F

更新时间: 2024-09-30 14:43:19
品牌 Logo 应用领域
恒忆 - NUMONYX 内存集成电路闪存
页数 文件大小 规格书
98页 2321K
描述
Flash, 16MX16, 70ns, PBGA64, 10 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, TBGA-64

M29W256GL70ZA6F 技术参数

是否Rohs认证:符合生命周期:Transferred
零件包装代码:BGA包装说明:TBGA, BGA64,8X8,40
针数:64Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.38Is Samacsys:N
最长访问时间:70 ns备用内存宽度:8
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PBGA-B64
长度:13 mm内存密度:268435456 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:256
端子数量:64字数:16777216 words
字数代码:16000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:16MX16封装主体材料:PLASTIC/EPOXY
封装代码:TBGA封装等效代码:BGA64,8X8,40
封装形状:RECTANGULAR封装形式:GRID ARRAY
页面大小:8/16 words并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:128K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.015 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:YES类型:NOR TYPE
宽度:10 mm最长写入周期时间 (tWC):0.00007 ms
Base Number Matches:1

M29W256GL70ZA6F 数据手册

 浏览型号M29W256GL70ZA6F的Datasheet PDF文件第2页浏览型号M29W256GL70ZA6F的Datasheet PDF文件第3页浏览型号M29W256GL70ZA6F的Datasheet PDF文件第4页浏览型号M29W256GL70ZA6F的Datasheet PDF文件第5页浏览型号M29W256GL70ZA6F的Datasheet PDF文件第6页浏览型号M29W256GL70ZA6F的Datasheet PDF文件第7页 
M29W256GH  
M29W256GL  
256-Mbit (32 Mbit x8 or 16 Mbit x16, page, uniform block)  
3 V supply flash memory  
Features  
BGA  
„ Supply voltage  
– VCC = 2.7 to 3.6 V for program, erase, read  
– VCCQ = 1.65 to 3.6 V for I/O buffers  
– VPPH = 12 V for fast program (optional)  
LBGA (ZS)  
11 x 13 mm  
TSOP56 (N)  
14 x 20 mm  
„ Asynchronous random/page read  
– Page size: 8 words or 16 bytes  
– Page access: 25, 30 ns  
BGA  
– Random access: 60 (only available upon  
customer request) or 70, 80 ns  
TBGA64 (ZA)  
10 x 13 mm  
„ Fast program commands  
– 32 words (64-byte write buffer)  
– Faster block and chip erase  
„ Enhanced buffered program commands  
„ VPP/WP pin for fast program and write: protects  
first or last block regardless of block protection  
settings  
– 256 words  
„ Programming time  
„ Software protection:  
– Volatile protection  
– 16 μs per byte/word typical  
– Chip program time: 10 s with VPPH and  
16 s without VPPH  
– Non-volatile protection  
– Password protection  
„ Memory organization  
– M29256GH/L: 256 main blocks,  
128 Kbytes/64 Kwords each  
„ Common flash interface  
– 64-bit security code  
„ Program/erase controller  
„ 128-word extended memory block  
– Embedded byte/word program algorithms  
– Extra block used as security block or to  
store additional information  
„ Program/ erase suspend and resume  
– Read from any block during program  
suspend  
„ Low power consumption  
– Standby and automatic standby  
– Read and program another block during  
erase suspend  
„ Minimum 100,000 program/erase cycles per  
block  
„ Unlock Bypass/Block Erase/Chip Erase/Write  
„ RoHS compliant packages  
to Buffer/Enhanced Buffer Program commands  
„ Automotive device grade: Temperature -40 °C  
– Faster production/batch programming  
to 85 °C (Automotive grade certified)  
Table 1.  
Device summary  
Root part number  
M29W256GH / M29W256GL  
Device code  
227Eh + 2222h + 2201  
December 2008  
208012 -01  
1/98  
www.numonyx.com  
1

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