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M29W128GH70ZA6F PDF预览

M29W128GH70ZA6F

更新时间: 2024-09-21 14:59:03
品牌 Logo 应用领域
镁光 - MICRON /
页数 文件大小 规格书
76页 841K
描述
128Mb (16Mb x8 or 8Mb x16), 3V, Page, Uniform Block, Parallel NOR Flash Memory

M29W128GH70ZA6F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TBGA, BGA64,8X8,40针数:64
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.34
最长访问时间:70 ns备用内存宽度:8
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PBGA-B64
JESD-609代码:e1长度:13 mm
内存密度:131072 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:128端子数量:64
字数:8192 words字数代码:8000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8KX16
封装主体材料:PLASTIC/EPOXY封装代码:TBGA
封装等效代码:BGA64,8X8,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE页面大小:8/16 words
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:3/3.3 V编程电压:3 V
认证状态:Not Qualified就绪/忙碌:YES
座面最大高度:1.2 mm部门规模:128K
最大待机电流:0.0001 A子类别:Flash Memories
最大压摆率:0.02 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
切换位:YES类型:NOR TYPE
宽度:10 mmBase Number Matches:1

M29W128GH70ZA6F 数据手册

 浏览型号M29W128GH70ZA6F的Datasheet PDF文件第2页浏览型号M29W128GH70ZA6F的Datasheet PDF文件第3页浏览型号M29W128GH70ZA6F的Datasheet PDF文件第4页浏览型号M29W128GH70ZA6F的Datasheet PDF文件第5页浏览型号M29W128GH70ZA6F的Datasheet PDF文件第6页浏览型号M29W128GH70ZA6F的Datasheet PDF文件第7页 
128Mb 3V Embedded Parallel NOR Flash  
Features  
Parallel NOR Flash Embedded Memory  
M29W128GH, M29W128GL  
• VPP/WP# pin protection  
– Protects first or last block regardless of block  
Features  
• Supply voltage  
protection settings  
– VCC = 2.7–3.6V (program, erase, read)  
– VCCQ = 1.65–3.6V (I/O buffers)  
– VPPH = 12V for fast program (optional)  
• Asynchronous random/page read  
– Page size: 8 words or 16 bytes  
– Page access: 25, 30ns  
• Software protection  
– Volatile protection  
– Nonvolatile protection  
– Password protection  
• Extended memory block  
– 128-word (256-byte) memory block for perma-  
nent, secure identification  
• Common flash interface  
– 64-bit security code  
• Low power consumption: Standby and automatic  
mode  
• Minimum 100,00 PROGRAM/ERASE cycles per  
block  
– Random access: 60ns1, 70, 80ns  
• Fast program commands: 32-word (64-byte) write  
buffer  
• Enhanced buffered program commands: 256-word  
• Program time  
– 16µs per byte/word TYP  
– Chip program time: 5s with VPPH and 8s without  
VPPH  
• Memory organization  
– Uniform blocks: 128 main blocks, 128-Kbytes or  
64-Kwords each  
• Program/erase controller  
• RoHS compliant packages  
– 56-pin TSOP (N) 14mm x 20mm  
– 64-ball TBGA (ZA) 10mm x 13mm  
– 64-ball FBGA (ZS) 11mm x 13mm  
• Electronic signature  
– Embedded byte/word program algorithms  
• Program/erase suspend and resume capability  
– Read from any block during a PROGRAM SUS-  
PEND operation  
– Read or program another block during an ERASE  
SUSPEND operation  
• Unlock bypass, block erase, chip erase, write to buf-  
fer, enhanced buffer program commands  
– Fast buffered/batch programming  
– Fast block/chip erase  
– Manufacturer code: 0020h  
– M29W128GH uniform, last block protected by  
VPP/WP#: 227Eh + 2221h + 2201h  
– M29W128GL uniform, first block protected by  
VPP/WP#: 227Eh + 2221h + 2200h  
• Automotive device grade temperature  
– –40°C to +125°C (automotive grade certified)  
1. The 60ns device is available upon customer  
request.  
Note:  
PDF: 09005aef84daa141  
m29w_128mb.pdf - Rev. A 7/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
1
© 2012 Micron Technology, Inc. All rights reserved.  
Products and specifications discussed herein are subject to change by Micron without notice.  

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