品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | 闪存 | |
页数 | 文件大小 | 规格书 |
24页 | 434K | |
描述 | ||
1 Mbit (64Kb x16, Boot Block) Single Supply Flash Memory |
是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | TSOP | 包装说明: | 10 X 14 MM, PLASTIC, TSOP-40 |
针数: | 40 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.61 | 最长访问时间: | 35 ns |
其他特性: | BOTTOM BOOT BLOCK | 启动块: | BOTTOM |
命令用户界面: | YES | 数据轮询: | YES |
JESD-30 代码: | R-PDSO-G40 | JESD-609代码: | e0 |
长度: | 12.4 mm | 内存密度: | 1048576 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 部门数/规模: | 1,2,1,1 |
端子数量: | 40 | 字数: | 65536 words |
字数代码: | 64000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 64KX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP1 | 封装等效代码: | TSSOP40,.56,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 240 |
电源: | 5 V | 编程电压: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
部门规模: | 8K,4K,16K,32K | 最大待机电流: | 0.0001 A |
子类别: | Flash Memories | 最大压摆率: | 0.02 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 切换位: | YES |
类型: | NOR TYPE | 宽度: | 10 mm |
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