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M29F100B-120XN3RTR PDF预览

M29F100B-120XN3RTR

更新时间: 2024-11-04 13:09:59
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
30页 210K
描述
128KX8 FLASH 5V PROM, 120ns, PDSO48, 12 X 20 MM, PLASTIC, REVERSE, TSOP-48

M29F100B-120XN3RTR 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:TSOP包装说明:12 X 20 MM, PLASTIC, REVERSE, TSOP-48
针数:48Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.51最长访问时间:120 ns
其他特性:CONFIGURABLE AS 64K X 16备用内存宽度:8
启动块:BOTTOM命令用户界面:YES
数据轮询:YESJESD-30 代码:R-PDSO-G48
JESD-609代码:e0长度:18.4 mm
内存密度:1048576 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:1,2,1,1端子数量:48
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:125 °C
最低工作温度:-40 °C组织:128KX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1-R
封装等效代码:TSSOP48,.8,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
电源:5 V编程电压:5 V
认证状态:Not Qualified就绪/忙碌:YES
反向引出线:YES座面最大高度:1.2 mm
部门规模:16K,8K,32K,64K最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.02 mA
最大供电电压 (Vsup):5.25 V最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
切换位:YES类型:NOR TYPE
宽度:12 mmBase Number Matches:1

M29F100B-120XN3RTR 数据手册

 浏览型号M29F100B-120XN3RTR的Datasheet PDF文件第2页浏览型号M29F100B-120XN3RTR的Datasheet PDF文件第3页浏览型号M29F100B-120XN3RTR的Datasheet PDF文件第4页浏览型号M29F100B-120XN3RTR的Datasheet PDF文件第5页浏览型号M29F100B-120XN3RTR的Datasheet PDF文件第6页浏览型号M29F100B-120XN3RTR的Datasheet PDF文件第7页 
M29F100T  
M29F100B  
1 Mbit (128Kb x8 or 64Kb x16, Boot Block)  
Single Supply Flash Memory  
5V ± 10% SUPPLYVOLTAGEfor PROGRAM,  
ERASE and READ OPERATIONS  
FASTACCESS TIME: 70ns  
FAST PROGRAMMING TIME  
– 10 s by Byte / 16 s by Word typical  
µ
µ
44  
PROGRAM/ERASE CONTROLLER (P/E.C.)  
– Program Byte-by-Byte or Word-by-Word  
– Status Register bits and Ready/Busy Output  
MEMORY BLOCKS  
– Boot Block (Top or Bottom location)  
– Parameterand Main blocks  
1
TSOP48 (N)  
12 x 20 mm  
SO44 (M)  
BLOCK, MULTI-BLOCK and CHIP ERASE  
MULTI-BLOCKPROTECTION/TEMPORARY  
UNPROTECTION MODES  
ERASE SUSPEND and RESUME MODES  
– Read and Program another Block during  
Erase Suspend  
Figure 1. Logic Diagram  
LOW POWER CONSUMPTION  
– Stand-byand AutomaticStand-by  
100,000 PROGRAM/ERASE CYCLES per  
BLOCK  
20 YEARSDATARETENTION  
– Defectivity below 1ppm/year  
ELECTRONIC SIGNATURE  
V
CC  
16  
15  
– ManufacturerCode: 0020h  
– Device Code, M29F100T: 00D0h  
– Device Code, M29F100B: 00D1h  
A0-A15  
DQ0-DQ14  
W
E
DQ15A–1  
BYTE  
RB  
M29F100T  
M29F100B  
DESCRIPTION  
The M29F100 is a non-volatile memory that may  
be erased electrically at the block or chiplevel and  
programmedin-systemona Byte-by-Byteor Word-  
by-Word basis using only a single 5V VCC supply.  
For Program and Erase operations the necessary  
high voltages are generatedinternally. The device  
can also be programmed in standard program-  
mers.  
G
RP  
V
The array matrix organisationallows each block to  
be erased and reprogrammed without affecting  
other blocks. Blocks can be protectedagainst pro-  
graming and erase on programming equipment,  
and temporarily unprotected to make changes in  
the application. Each block can be programmed  
and erased over 100,000 cycles.  
SS  
AI01974  
July 1998  
1/30  

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