是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP | 包装说明: | 8 X 20 MM, PLASTIC, TSOP-32 |
针数: | 32 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.11 | Is Samacsys: | N |
最长访问时间: | 70 ns | 其他特性: | BOTTOM BOOT BLOCK |
启动块: | BOTTOM | 命令用户界面: | YES |
数据轮询: | YES | 耐久性: | 100000 Write/Erase Cycles |
JESD-30 代码: | R-PDSO-G32 | JESD-609代码: | e3 |
长度: | 18.4 mm | 内存密度: | 2097152 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
功能数量: | 1 | 部门数/规模: | 1,2,1,3 |
端子数量: | 32 | 字数: | 262144 words |
字数代码: | 256000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 70 °C | 最低工作温度: | |
组织: | 256KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP1 | 封装等效代码: | TSSOP32,.8,20 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 5 V | 编程电压: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
部门规模: | 16K,8K,32K,64K | 最大待机电流: | 0.0001 A |
子类别: | Flash Memories | 最大压摆率: | 0.02 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | MATTE TIN | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 切换位: | YES |
类型: | NOR TYPE | 宽度: | 8 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
AM29F002NBB-70EI | AMD |
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M29F002BB120N1F | STMICROELECTRONICS |
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暂无描述 | |
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