生命周期: | Obsolete | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | unknown | 风险等级: | 5.4 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 40 MHz |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3/e4 |
长度: | 5.3 mm | 内存密度: | 8388608 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 1MX8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
编程电压: | 2.7 V | 认证状态: | Not Qualified |
座面最大高度: | 2.03 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 温度等级: | AUTOMOTIVE |
端子面层: | MATTE TIN/NICKEL PALLADIUM GOLD | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 5.25 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
W25Q80BWSNIG | WINBOND |
功能相似 |
1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI | |
W25Q80BWSNIP | WINBOND |
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1.8V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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