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M25P05-AVMP6TG PDF预览

M25P05-AVMP6TG

更新时间: 2024-11-14 14:59:03
品牌 Logo 应用领域
镁光 - MICRON /
页数 文件大小 规格书
132页 1301K
描述
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.

M25P05-AVMP6TG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:HVSON, SOLCC8,.25针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.54
Is Samacsys:N其他特性:40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST
最大时钟频率 (fCLK):25 MHz耐久性:100000 Write/Erase Cycles
JESD-30 代码:R-PDSO-N8长度:6 mm
内存密度:524288 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:8字数:65536 words
字数代码:64000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:64KX8封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装等效代码:SOLCC8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
并行/串行:SERIAL峰值回流温度(摄氏度):260
电源:3/3.3 V编程电压:2.7 V
认证状态:Not Qualified座面最大高度:1 mm
串行总线类型:SPI最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.015 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
类型:NOR TYPE宽度:5 mm
写保护:HARDWARE/SOFTWAREBase Number Matches:1

M25P05-AVMP6TG 数据手册

 浏览型号M25P05-AVMP6TG的Datasheet PDF文件第2页浏览型号M25P05-AVMP6TG的Datasheet PDF文件第3页浏览型号M25P05-AVMP6TG的Datasheet PDF文件第4页浏览型号M25P05-AVMP6TG的Datasheet PDF文件第5页浏览型号M25P05-AVMP6TG的Datasheet PDF文件第6页浏览型号M25P05-AVMP6TG的Datasheet PDF文件第7页 
Micron Confidential and Proprietary  
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory  
Features  
NAND Flash Memory  
MT29F4G08ABADAH4, MT29F4G08ABADAWP, MT29F4G08ABBDAH4,  
MT29F4G08ABBDAHC, MT29F4G16ABADAH4, MT29F4G16ABADAWP,  
MT29F4G16ABBDAH4, MT29F4G16ABBDAHC, MT29F8G08ADADAH4,  
MT29F8G08ADBDAH4, MT29F8G16ADADAH4, MT29F8G16ADBDAH4,  
MT29F16G08AJADAWP  
• First block (block address 00h) is valid when ship-  
ped from factory with ECC. For minimum required  
ECC, see Error Management.  
• Block 0 requires 1-bit ECC if PROGRAM/ERASE cy-  
cles are less than 1000  
Features  
• Open NAND Flash Interface (ONFI) 1.0-compliant1  
• Single-level cell (SLC) technology  
• Organization  
– Page size x8: 2112 bytes (2048 + 64 bytes)  
– Page size x16: 1056 words (1024 + 32 words)  
– Block size: 64 pages (128K + 4K bytes)  
– Plane size: 2 planes x 2048 blocks per plane  
– Device size: 4Gb: 4096 blocks; 8Gb: 8192 blocks  
16Gb: 16,384 blocks  
• RESET (FFh) required as first command after pow-  
er-on  
• Alternate method of device initialization (Nand_In-  
it) after power up (contact factory)  
• Internal data move operations supported within the  
plane from which data is read  
• Quality and reliability  
– Data retention: 10 years  
– Endurance: 100,000 PROGRAM/ERASE cycles  
• Operating voltage range  
• Asynchronous I/O performance  
tRC/tWC: 20ns (3.3V), 25ns (1.8V)  
• Array performance  
– Read page: 25µs 3  
– Program page: 200µs (TYP: 1.8V, 3.3V)3  
– Erase block: 700µs (TYP)  
– VCC: 2.7–3.6V  
– VCC: 1.7–1.95V  
• Operating temperature:  
• Command set: ONFI NAND Flash Protocol  
• Advanced command set  
– Commercial: 0°C to +70°C  
– Industrial (IT): –40ºC to +85ºC  
• Package  
– Program page cache mode4  
– Read page cache mode 4  
– 48-pin TSOP type 1, CPL2  
– 63-ball VFBGA  
– One-time programmable (OTP) mode  
Two-plane commands 4  
– Interleaved die (LUN) operations  
– Read unique ID  
– Block lock (1.8V only)  
– Internal data move  
• Operation status byte provides software method for  
detecting  
1. The ONFI 1.0 specification is available at  
www.onfi.org.  
Notes:  
2. CPL = Center parting line.  
3. See Program and Erase Characteristics for  
tR_ECC and tPROG_ECC specifications.  
4. These commands supported only with ECC  
disabled.  
– Operation completion  
– Pass/fail condition  
– Write-protect status  
• Ready/Busy# (R/B#) signal provides a hardware  
method of detecting operation completion  
• WP# signal: Write protect entire device  
PDF: 09005aef83b25735  
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
1
© 2009 Micron Technology, Inc. All rights reserved.  
Products and specifications discussed herein are subject to change by Micron without notice.  

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