5秒后页面跳转
M24L816512DA-70BEG PDF预览

M24L816512DA-70BEG

更新时间: 2024-02-10 17:40:37
品牌 Logo 应用领域
晶豪 - ESMT /
页数 文件大小 规格书
12页 310K
描述
8-Mbit (512K x 16) Pseudo Static RAM

M24L816512DA-70BEG 技术参数

生命周期:Contact Manufacturer零件包装代码:DSBGA
包装说明:TFBGA,针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.55
最长访问时间:70 nsJESD-30 代码:R-PBGA-B48
长度:8 mm内存密度:8388608 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
功能数量:1端子数量:48
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
宽度:6 mmBase Number Matches:1

M24L816512DA-70BEG 数据手册

 浏览型号M24L816512DA-70BEG的Datasheet PDF文件第2页浏览型号M24L816512DA-70BEG的Datasheet PDF文件第3页浏览型号M24L816512DA-70BEG的Datasheet PDF文件第4页浏览型号M24L816512DA-70BEG的Datasheet PDF文件第5页浏览型号M24L816512DA-70BEG的Datasheet PDF文件第6页浏览型号M24L816512DA-70BEG的Datasheet PDF文件第7页 
ESMT  
M24L816512DA  
PSRAM  
8-Mbit (512K x 16)  
Pseudo Static RAM  
Features  
Functional Description  
Advanced low-power architecture  
The M24L816512DA is a high-performance CMOS pseudo  
static RAM (PSRAM) organized as 512K words by 16 bits that  
supports an asynchronous memory interface. This device  
features advanced circuit design to provide ultra-low active  
current. This is ideal for portable applications such as cellular  
telephones. The device can be put into standby mode  
reducing power consumption dramatically when deselected  
• High speed: 55 ns, 70 ns  
• Wide voltage range: 2.7V to 3.6 V  
• Typical active current: 2 mA @ f = 1 MHz  
• Typical active current: 11 mA @ f = fMAX  
• Low standby power  
• Automatic power-down when deselected  
( CE1 LOW, CE2 HIGH or both BHE and BLE are HIGH).  
The input/output pins(I/O0 through I/O15) are placed in a  
high-impedance state when: deselected ( CE1 HIGH, CE2  
LOW), OE is deasserted HIGH, or during a write operation  
(Chip Enabled and Write Enable WE LOW). Reading from  
the device is accomplished by asserting the Chip Enables  
( CE1 LOW and CE2 HIGH) and Output Enable ( OE ) LOW  
while forcing the Write Enable ( WE ) HIGH. If Byte Low  
Enable (BLE ) is LOW, then data from the memory location  
specified by the address pins will appear on I/O0 to I/O7. If  
Byte High Enable (BHE ) is LOW, then data from memory will  
appear on I/O8 to I/O15. See the Truth Table for a complete  
description of read and write modes.  
Logic Block Diagram  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jul. 2008  
Revision : 1.1  
1/12  

与M24L816512DA-70BEG相关器件

型号 品牌 获取价格 描述 数据表
M24L816512DA-70BIG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-55BEG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-55BIG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-55TEG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-55TIG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-70BEG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-70BIG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-70TEG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM
M24L816512SA-70TIG ESMT

获取价格

8-Mbit (512K x 16) Pseudo Static RAM