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M24L48512DA PDF预览

M24L48512DA

更新时间: 2024-09-26 05:44:55
品牌 Logo 应用领域
晶豪 - ESMT /
页数 文件大小 规格书
12页 278K
描述
4-Mbit (512K x 8) Pseudo Static RAM

M24L48512DA 数据手册

 浏览型号M24L48512DA的Datasheet PDF文件第2页浏览型号M24L48512DA的Datasheet PDF文件第3页浏览型号M24L48512DA的Datasheet PDF文件第4页浏览型号M24L48512DA的Datasheet PDF文件第5页浏览型号M24L48512DA的Datasheet PDF文件第6页浏览型号M24L48512DA的Datasheet PDF文件第7页 
ESMT  
M24L48512DA  
PSRAM  
4-Mbit (512K x 8)  
Pseudo Static RAM  
Features  
Enable ( WE )inputs LOW and Chip Enable Two (CE2) input  
HIGH. Data on the eight I/O pins (I/O0 through I/O15) is then  
written into the location specified on the address pins (A0  
through A18).  
• Advanced low power architecture  
• High speed: 55 ns, 60 ns and 70 ns  
• Wide voltage range: 2.7V to 3.6V  
• Typical active current: 1mA @ f = 1 MHz  
• Low standby power  
Reading from the device is accomplished by asserting the  
Chip Enable One ( CE1) and Output Enable ( OE ) inputs LOW  
while forcing Write Enable ( WE ) HIGH and Chip Enable  
Two(CE2) HIGH. Under these conditions, the contents of the  
memory location specified by the address pins will appear on  
the I/O pins.  
• Automatic power-down when deselected  
Functional Description  
The eight input/output pins (I/O0 through I/O7) are placed in a  
The M24L48512DA is a high-performance CMOS pseudo  
static RAM (PSRAM) organized as 512K words by 8 bits. Easy  
memory expansion is provided by an active LOW Chip  
high-impedance state when the device is deselected CE1  
HIGH or CE2 LOW), the outputs are disabled ( OE HIGH), or  
Enable( CE1), an active HIGH Chip Enable (CE2), and active  
during write operation ( CE1 LOW, CE2 HIGH, and WE  
LOW).See the Truth Table for a complete description of read  
and write modes.  
LOW Output Enable ( OE ).This device has an automatic  
power-down feature that reduces power consumption  
dramatically when deselected. Writing to the device is  
accomplished by taking Chip Enable One ( CE1) and Write  
Logic Block Diagram  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jul. 2008  
Revision : 1.1  
1/12  

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