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M24L28256SA-55BIG PDF预览

M24L28256SA-55BIG

更新时间: 2024-09-24 05:44:55
品牌 Logo 应用领域
晶豪 - ESMT /
页数 文件大小 规格书
12页 243K
描述
2-Mbit (256K x 8) Pseudo Static RAM

M24L28256SA-55BIG 技术参数

生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:VFBGA,针数:36
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.79
最长访问时间:55 nsJESD-30 代码:R-PBGA-B36
长度:8 mm内存密度:2097152 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:8
功能数量:1端子数量:36
字数:262144 words字数代码:256000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX8
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:1 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
宽度:6 mmBase Number Matches:1

M24L28256SA-55BIG 数据手册

 浏览型号M24L28256SA-55BIG的Datasheet PDF文件第2页浏览型号M24L28256SA-55BIG的Datasheet PDF文件第3页浏览型号M24L28256SA-55BIG的Datasheet PDF文件第4页浏览型号M24L28256SA-55BIG的Datasheet PDF文件第5页浏览型号M24L28256SA-55BIG的Datasheet PDF文件第6页浏览型号M24L28256SA-55BIG的Datasheet PDF文件第7页 
ESMT  
M24L28256SA  
PSRAM  
2-Mbit (256K x 8)  
Pseudo Static RAM  
Features  
the device is accomplished by asserting Chip Enable ( CE )  
•Advanced low-power architecture  
•High speed: 55 ns, 70 ns  
•Wide voltage range: 2.7V to 3.6V  
•Typical active current: 1 mA @ f = 1 MHz  
•Low standby power  
and Write Enable ( WE ) inputs LOW .Data on the eight I/O  
pins(I/O0 through I/O7) is then written into the location  
specified on the address pins (A0 through A17).  
Reading from the device is accomplished by asserting the  
Chip Enable One ( CE ) and Output Enable ( OE ) inputs LOW  
•Automatic power-down when deselected  
while forcing Write Enable ( WE ) HIGH. Under these  
conditions, the contents of the memory location specified by  
the address pins will appear on the I/O pins.  
Functional Description  
The eight input/output pins (I/O0 through I/O7) are placed in a  
The M24L28256SA is a high-performance CMOS pseudo  
static RAM (PSRAM) organized as 256K words by 8 bits.  
Easy memory expansion is provided by an active LOW Chip  
high-impedance state when the device is deselected ( CE  
HIGH ), the outputs are disabled ( OE HIGH), or during write  
Enable( CE ) and active LOW Output Enable ( OE ).This  
device has an automatic power-down feature that reduces  
power consumption dramatically when deselected. Writing to  
operation ( CE LOW and WE LOW). See the Truth Table  
for a complete description of read and write modes.  
Logic Block Diagram  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jul. 2008  
Revision : 1.1  
1/12  

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