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M24L216128DA-55BIG PDF预览

M24L216128DA-55BIG

更新时间: 2024-02-23 15:33:45
品牌 Logo 应用领域
晶豪 - ESMT 存储内存集成电路静态存储器
页数 文件大小 规格书
14页 345K
描述
2-Mbit (128K x 16) Pseudo Static RAM

M24L216128DA-55BIG 技术参数

生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:VFBGA,针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.76
Is Samacsys:N最长访问时间:55 ns
JESD-30 代码:R-PBGA-B48长度:8 mm
内存密度:2097152 bit内存集成电路类型:PSEUDO STATIC RAM
内存宽度:16功能数量:1
端子数量:48字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX16封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM宽度:6 mm
Base Number Matches:1

M24L216128DA-55BIG 数据手册

 浏览型号M24L216128DA-55BIG的Datasheet PDF文件第2页浏览型号M24L216128DA-55BIG的Datasheet PDF文件第3页浏览型号M24L216128DA-55BIG的Datasheet PDF文件第4页浏览型号M24L216128DA-55BIG的Datasheet PDF文件第5页浏览型号M24L216128DA-55BIG的Datasheet PDF文件第6页浏览型号M24L216128DA-55BIG的Datasheet PDF文件第7页 
ESMT  
M24L216128DA  
PSRAM  
2-Mbit (128K x 16)  
Pseudo Static RAM  
Features  
Functional Description  
Advanced low-power architecture  
The M24L216128DA is a high-performance CMOS pseudo  
static RAM (PSRAM) organized as 128K words by 16 bits that  
supports an asynchronous memory interface. This device  
features advanced circuit design to provide ultra-low active  
current. This is ideal for portable applications such as cellular  
telephones. The device can be put into standby mode,  
reducing power consumption dramatically when deselected  
• High speed: 55 ns, 70 ns  
• Wide voltage range: 2.7V to 3.6V  
• Typical active current: 1 mA @ f = 1 MHz  
• Low standby power  
• Automatic power-down when deselected  
( CE1 HIGH, CE2 LOW or both BHE and BLE are HIGH).  
The input/output pins(I/O0 through I/O15) are placed in a  
high-impedance state when the chip is deselected ( CE1  
HIGH, CE2 LOW) or OE is deasserted HIGH), or during a  
write operation (Chip Enabled and Write Enable WE LOW).  
Reading from the device is accomplished by asserting the  
Chip Enables ( CE1 LOW and CE2 HIGH) and Output Enable  
(OE) LOW while forcing the Write Enable ( WE ) HIGH. If Byte  
Low Enable ( BLE ) is LOW, then data from the memory  
location specified by the address pins will appear on I/O0 to  
I/O7. If Byte High Enable ( BHE ) is LOW, then data from  
memory will appear on I/O8 to I/O15. Seethe Truth Table for a  
complete description of read and write modes.  
Logic Block Diagram  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jul. 2008  
Revision : 1.2  
1/14  

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