是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | SOIC | 包装说明: | TSSOP, TSSOP8,.19 |
针数: | 8 | Reach Compliance Code: | compliant |
风险等级: | 5.65 | Is Samacsys: | N |
最大时钟频率 (fCLK): | 0.4 MHz | 数据保留时间-最小值: | 40 |
耐久性: | 1000000 Write/Erase Cycles | I2C控制字节: | 1010DDMR |
JESD-30 代码: | S-PDSO-G8 | JESD-609代码: | e3 |
长度: | 3 mm | 内存密度: | 4096 bit |
内存集成电路类型: | EEPROM | 内存宽度: | 8 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 512 words |
字数代码: | 512 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
组织: | 512X8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP8,.19 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
电源: | 5 V | 认证状态: | Not Qualified |
筛选级别: | AEC-Q100 | 座面最大高度: | 1.1 mm |
串行总线类型: | I2C | 最大待机电流: | 0.000005 A |
子类别: | EEPROMs | 最大压摆率: | 0.003 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | MATTE TIN | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 3 mm |
最长写入周期时间 (tWC): | 10 ms | 写保护: | HARDWARE |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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