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M2002T023 33.333300 PDF预览

M2002T023 33.333300

更新时间: 2024-09-16 14:55:03
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M2002T023 33.333300 数据手册

 浏览型号M2002T023 33.333300的Datasheet PDF文件第2页 
SPECIFICATION FOR RoHS 6 COMPLIANT HCMOS SMT OSCILLATOR  
MtronPTI P/N: M2002T023  
Electrical Specifications:  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Units  
Conditions  
Frequency of Operation  
FO  
33.333300  
MHz  
Inclusive of initial tolerance  
at +25°C, deviation over  
temperature, shock,  
Frequency Stability  
-100  
+100  
ppm  
F/F  
vibration, voltage & load  
variations and 1 year aging  
Operating Temperature  
Storage Temperature  
Operating Voltage  
Operating Current  
Output Type  
TA  
TS  
VDD  
IDD  
-10  
-55  
3.135  
+70  
+125  
3.465  
20  
°C  
°C  
V
3.3  
mA  
HCMOS Compatible  
15  
Output Load  
pF  
mA  
mA  
μA  
%
V
V
ns  
IOL  
IOH  
ISB  
TDC  
VOH  
VOL  
TR/TF  
+2  
-2  
HCMOS load  
HCMOS load  
Output Current  
Standby Current  
Symmetry (duty cycle)  
Logic “1” Level  
Logic “0” Level  
Rise/Fall Time  
10  
55  
45  
90% VDD  
@ 50% of VDD  
HCMOS load  
HCMOS load  
From 10% to 90% VDD  
10% VDD  
6
0.5  
80% VDD  
or N/C  
Tri-state Enable Logic  
V
Pad 1. Clock Signal Output  
Tri-state Disable Logic  
Period Jitter  
Period Jitter (pk-pk)  
Random Jitter  
Phase Jitter  
Start-up Time  
20% VDD  
12  
V
Pad 1. Output to high-Z  
@ 33.3333MHz  
PJ  
PJPP  
RJ  
ΦJ  
TSU  
3.3  
30  
pS RMS  
pS pk-pk  
pS RMS  
pS RMS  
mS  
1-Sigma  
Integrated 12kHz to 20MHz  
0.3  
10  
Environmental Conditions:  
Mechanical Shock  
Vibration  
Thermal Cycle  
Per JESD22-B-104-A 1500g Peak 0.5 msec duration 5 pulses in 6 directions  
Per JESD22-B-103-A 20g Peak (20-2000 Hz) in X, Y and Z directions  
Per MIL-STD-883, Method 1010, B (-55°C to 125°C, 15 min. dwell, 10 cycles)  
Per MIL-STD-202, Method 112 (1 x 10-8 atm cc/s of Helium)  
2000 volts; Per JESD22A-114-A  
Hermeticity  
ESD-Human Body Model  
ESD-Machine Model  
Solderability  
200 volts; Per JESD22A-115-A  
Per EIAJ-STD-002  
Max. Soldering Conditions  
Package Type  
Termination (Pad) Material  
Moisture Sensitivity Level  
See solder profile, Figure 1  
5.0 x 7.0 x 1.7 mm, 4-pad Ceramic Leadless Chip Carrier (M2 type)  
10 to 15 µm of tungsten (W), 1.29 to 8.89 µm of nickel (Ni), 0.3 to 1.0 µm of gold (Au)  
1
1 of 2  
The information contained herein is proprietary to MtronPTI and is submitted in confidence.  
This information may not be copied or divulged without written permission from MtronPTI.