Specification for an SMT – Gullwing Oscillator
MtronPTI P/N: M2002S992
I. GENERAL & ELECTRICAL REQUIREMENTS:
II.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Frequency of Operation
Initial Frequency Tolerance
Frequency Stability
FO
14.745600
Frequency Stabilities
MHz
-25
+25
ppm
ppm
@ 23°C ±3°C
Includes initial tolerance, deviation
over temperature, shock, vibration,
voltage & load variations, and aging
-100
+100
F/F
Output
Output Type
HCMOS/TTL Compatible
Output Load
Symmetry (duty cycle)
Logic “1” Level
15
60
pF
%
V
TDC
VOH
40
90% VDD
@ 50% of waveform
HCMOS load
10%
VDD
Logic “0” Level
VOL
V
HCMOS load
Rise/Fall Time
TR/TF
10
nsec
From 10% to 90% VCC
Additional Specifications
Start-up Time
TSU
10
msec
Enable/Disable Time
150
nS
Enable
Disable
Logic High. or N/C
Logic Low.
Pad 1: Output Enabled
Pad 1: Output is high-Z when disabled
Enable/Disable Function
V
Supply and Temperature
Operating Voltage
Operating Current
Operating Temperature
VCC
ICC
OTR
2.97
-55
3.3
3.63
15
+125
VDC
mA
°C
II. ENVIRONMENTAL/MECHANICAL REQUIREMENTS:
Mechanical Shock
Vibration
Thermal Cycle
Storage Temperature
Per MIL-STD-202, Method 213, Condition C (100 g’s, 6 mS duration, ½ Sinewave)
Per MIL-STD-202, Method 201 & 204 (10 g’s from 10-2000 Hz)
Per MIL-STD-883, Method 1010, B (-55°C to 125°C, 15 min. dwell, 10 cycles)
-55°C to +125°C
MIL-STD-883, Method 1014, Test Condition A1 for Fine Leak, Test Condition C1 for Gross
Leak
Hermeticity
Solderability
Per MIL-STD-883, Method 2003
Max. Soldering Conditions
Package Type
Reflow Conditions
Lead Attachment
Lead Pull Test
See solder profile, Figure 1
4 - Pad leadless ceramic package with (4) Gullwing Leads attached (M2 Type)
+260°C for 10 seconds. Max (See Section V)
Thermo-compression Weld using Copper Leads and Gold Pads
Shall withstand 8oz. pull per MIL-STD-883, Method 2004, Condition A
Hot Solder Dipped, Sn63Pb37 alloy or equivalent
Lead Finish
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