M1- M7
1.0 AMP. Surface Mount Rectifiers
SMA/DO-214AC
D A Y A
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Features
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For surface mounted application
Glass passivated junction chip.
Low forward voltage drop
High current capability
Easy pick and place
High surge current capability
Plastic material used carries Underwriters
Laboratory Classification 94V-0
High temperature soldering:
260oC / 10 seconds at terminals
High reliability grade (AEC Q101 qualified)
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Mechanical Data
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Case: Molded plastic
Dimensions in inches and (millimeters)
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Terminals: Pure tin plated, lead free
solderable per J-STD-002B and
JESD22-B102D.
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Polarity: Indicated by cathode band
Packaging: 12mm tape per EIA STD RS-481
Weight: 0.064 gram
Maximum Ratings and Electrical Characteristics
Rating at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Symbol M1
M2
100 200 400 600 800 1000
70 140 280 420 560 700
M3
M4
M5
M6
M7
Type Number
Units
V
Maximum Recurrent Peak Reverse Voltage
50
35
50
VRRM
VRMS
VDC
Maximum RMS Voltage
V
V
Maximum DC Blocking Voltage
100 200 400 600 800 1000
Maximum Average Forward Rectified
Current @TL =110 oC
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated
Load (JEDEC method )
1.0
A
A
I(AV)
IFSM
40
30
Maximum Instantaneous Forward Voltage
@ 1.0A
1.1
V
VF
IR
Maximum DC Reverse Current @ TA =25 oC
at Rated DC Blocking Voltage @ TA=125 oC
5.0
50
1.5
uA
uA
uS
Typical Reverse Recovery Time (Note 1)
Typical Junction Capacitance ( Note 2 )
Non-Repetitive Peak Reverse Avalanche
Trr
Cj
12
pF
5
mJ
EAS
Engergy at 25oC, I =1A, L=10mH
AS
Typical Thermal Resistance (Note 3)
27
75
30
85
R
R
θJL
oC/W
θJA
TJ
-55 to +150
-55 to +150
oC
Operating Temperature Range
Storage Temperature Range
oC
TSTG
Notes:
1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
2. Measured at 1 MHz and Applied VR=4.0 Volts
3. Measured on P.C. Board with 0.2” x 0.2” (5.0mm x 5.0mm) Copper Pad Areas.
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