5秒后页面跳转
M14D5121632A-1.8BBG2A PDF预览

M14D5121632A-1.8BBG2A

更新时间: 2024-02-20 08:32:54
品牌 Logo 应用领域
晶豪 - ESMT 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
64页 1089K
描述
DDR DRAM, 32MX16, 0.35ns, CMOS, PBGA84, BGA-84

M14D5121632A-1.8BBG2A 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:VFBGA,Reach Compliance Code:unknown
风险等级:5.61访问模式:FOUR BANK PAGE BURST
最长访问时间:0.35 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PBGA-B84长度:12.5 mm
内存密度:536870912 bit内存集成电路类型:DDR DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:84
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:32MX16
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:1 mm
自我刷新:YES最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:8 mm
Base Number Matches:1

M14D5121632A-1.8BBG2A 数据手册

 浏览型号M14D5121632A-1.8BBG2A的Datasheet PDF文件第2页浏览型号M14D5121632A-1.8BBG2A的Datasheet PDF文件第3页浏览型号M14D5121632A-1.8BBG2A的Datasheet PDF文件第4页浏览型号M14D5121632A-1.8BBG2A的Datasheet PDF文件第5页浏览型号M14D5121632A-1.8BBG2A的Datasheet PDF文件第6页浏览型号M14D5121632A-1.8BBG2A的Datasheet PDF文件第7页 
ESMT  
DDR II SDRAM  
M14D5121632A (2A)  
8M x 16 Bit x 4 Banks  
DDR II SDRAM  
Features  
z
z
z
JEDEC Standard  
VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V  
Internal pipelined double-data-rate architecture; two data access per clock cycle  
z
z
Bi-directional differential data strobe (DQS, DQS ); DQS can be disabled for single-ended data strobe operation.  
On-chip DLL  
z
z
Differential clock inputs (CLK and CLK )  
DLL aligns DQ and DQS transition with CLK transition  
Quad bank operation  
z
z
z
z
z
z
z
z
z
z
z
z
CAS Latency : 3, 4, 5, 6, 7, 8, 9  
Additive Latency: 0, 1, 2, 3, 4, 5, 6, 7  
Burst Type : Sequential and Interleave  
Burst Length : 4, 8  
All inputs except data & DM are sampled at the rising edge of the system clock(CLK)  
Data I/O transitions on both edges of data strobe (DQS)  
DQS is edge-aligned with data for READ; center-aligned with data for WRITE  
Data mask (DM) for write masking only  
Off-Chip-Driver (OCD) impedance adjustment  
On-Die-Termination for better signal quality  
Special function support  
-
-
-
-
50/ 75/ 150 ohm ODT  
High Temperature Self refresh rate enable  
Duty Cycle Corrector  
Partial Array Self Refresh (PASR)  
z
z
Auto & Self refresh  
Refresh cycle :  
-
-
8192 cycles/64ms (7.8μ s refresh interval) at 0 ℃ ≦ TC ≦ +85 ℃  
8192 cycles/32ms (3.9μ s refresh interval) at +85 ℃ < TC +95 ℃  
z
z
SSTL_18 interface  
If tCK < 1.875ns, the device can not support Write with Auto Precharge function.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Oct. 2016  
Revision : 1.0 1/64  

与M14D5121632A-1.8BBG2A相关器件

型号 品牌 获取价格 描述 数据表
M14D5121632A-1.8BBIG2K ESMT

获取价格

DDR DRAM, 32MX16, 0.35ns, CMOS, PBGA84, BGA-84
M14D5121632A-2.5BBG2A ESMT

获取价格

DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, BGA-84
M14D5121632A-2.5BG ESMT

获取价格

8M x 16 Bit x 4 Banks DDR II SDRAM
M14D5121632A-2.5BG2A ESMT

获取价格

DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, BGA-84
M14D5121632A-2.5BIG2H ESMT

获取价格

DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD F
M14D5121632A-2.5BIG2K ESMT

获取价格

DDR DRAM, 32MX16, 0.4ns, CMOS, PBGA84, BGA-84
M14D5121632A-3BG ESMT

获取价格

8M x 16 Bit x 4 Banks DDR II SDRAM
M14D5121632A-3BIG ESMT

获取价格

8M x 16 Bit x 4 Banks DDR II SDRAM
M14D5121632A-3BIG2H ESMT

获取价格

DDR DRAM, 32MX16, 0.45ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD
M14-SERIES ETC

获取价格

Interface IC