品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | / | |
页数 | 文件大小 | 规格书 |
13页 | 279K | |
描述 | ||
Memory Micromodules General Information for D1, D2 and C Packaging |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M14128-WD22 | STMICROELECTRONICS |
获取价格 |
128KX1 I2C/2-WIRE SERIAL EEPROM, UUC, DIE | |
M1412SL001 | ALPHAWIRE |
获取价格 |
Wire And Cable, | |
M1412SL002 | ALPHAWIRE |
获取价格 |
Wire And Cable, | |
M1412SL005 | ALPHAWIRE |
获取价格 |
Wire And Cable, | |
M141331FAP | TTELEC |
获取价格 |
Thick Film Low Profile SIP Conformal Coated Resistor Networks | |
M141331FM1 | TTELEC |
获取价格 |
Thick Film Low Profile SIP Conformal Coated Resistor Networks | |
M141331FM2 | TTELEC |
获取价格 |
Thick Film Low Profile SIP Conformal Coated Resistor Networks | |
M141331GAP | TTELEC |
获取价格 |
Thick Film Low Profile SIP Conformal Coated Resistor Networks | |
M141331GM1 | TTELEC |
获取价格 |
Thick Film Low Profile SIP Conformal Coated Resistor Networks | |
M141331GM2 | TTELEC |
获取价格 |
Thick Film Low Profile SIP Conformal Coated Resistor Networks |