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M14128 PDF预览

M14128

更新时间: 2024-09-22 22:30:47
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意法半导体 - STMICROELECTRONICS /
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13页 279K
描述
Memory Micromodules General Information for D1, D2 and C Packaging

M14128 数据手册

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D10, D15, D20, D22, C20, C30  
MICROMODULES  
Memory Micromodules  
General Information for D1, D2 and C Packaging  
Micromodules were developed specifically for  
potting side  
contact side  
embedding in Smartcards and Memory Cards  
The Micromodule provides:  
– Support for the chip  
– Electrical contacts  
D15  
– Suitable embedding interface for gluing the  
module to the plastic package  
Physical dimensions and contact positions  
compliant to the ISO 7816 standard  
Micromodules delivered as a continuous Super  
35 mm tape. (This differs from the standard  
35 mm tape in the spacing distance between  
the indexing holes.)  
D10  
D20  
DESCRIPTION  
Memory Cards consist of two main parts: the  
plastic card, and the embedded Micromodule  
(which, in turn, carries the silicon chip).  
D22  
The plastic card is made of PVC, ABS or similar  
material, and can be over-printed with graphics,  
text, and magnetic strips. The Micromodule is  
embedded in a cavity in the plastic card.  
The Micromodules are mounted on Super 35 mm  
metallized epoxy tape, and are delivered on reels.  
These contain all of the chips from a number of  
wafers, including those chips that were found to be  
non-functioning during testing. Traceability is  
ensured by a label fixed on the reel.  
C30  
C20  
Table 1. Memory Card and Memory Tag Integrated Circuits  
Please see the data briefing sheets of these products for example illustrations of these  
micromodules  
Module  
D10  
D15  
D20  
D22  
C30  
C20  
ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355  
ST14C02, ST1305B, ST1335, ST1336, ST1355  
ST14C02, M14C04, M14C16, M14C32  
M14C64, M14128, M14256  
M35101, M35102  
M35101, M35102  
December 1999  
1/13  

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